“…Chen et al (2016) proposed a hybrid machining method by combining precision grinding with fly cutting to form the chamfered faces of KDP crystal, improving machining efficiency nearly five times. Qu et al (2019) used a resin-bonded diamond grinding wheel with Ni-P alloy coating on the abrasive grains to remove the surface material of KDP components with high process efficiency and low damage. However, the use of conventional grinding wheels is often constrained by impurities, such as debris from bond materials and lose grains embedded into ground surfaces due to the low hardness of these photoelectric crystals.…”