2019
DOI: 10.1016/j.aeue.2019.03.018
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Realization of a broadband hybrid X-band power amplifier based on f-doubler technique

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Cited by 11 publications
(6 citation statements)
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“…For example, with 𝑍 1 = 100 Ω, 𝑍 2 = 10 Ω, 𝑍 0 = 50 Ω, and VSWR = 1.2, the maximum bandwidth is about 40%. Generally, the low impedance line section is replaced by a radial line section, as shown in Figure 2c [6,11]. This arrangement provides better bandwidth than a 𝜆/4 open circuited line section and is smaller in size.…”
Section: Microstrip Biasing Circuitmentioning
confidence: 99%
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“…For example, with 𝑍 1 = 100 Ω, 𝑍 2 = 10 Ω, 𝑍 0 = 50 Ω, and VSWR = 1.2, the maximum bandwidth is about 40%. Generally, the low impedance line section is replaced by a radial line section, as shown in Figure 2c [6,11]. This arrangement provides better bandwidth than a 𝜆/4 open circuited line section and is smaller in size.…”
Section: Microstrip Biasing Circuitmentioning
confidence: 99%
“…One way to match one or more circuits is to insert a quarter-wave line between the impedance of the load and the input impedance line and to choose a suitable characteristic impedance. This is one of the simplest techniques to perform impedance matching in a narrow band [9,11].…”
Section: Impedance Matchingmentioning
confidence: 99%
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“…Moreover, their long lifetime and ease of maintenance make the design of high‐power amplifiers using single GaN‐HEMT bare‐dies possible and hence make them the right candidate for space applications 1‐4 . Since then, numerous SSPA designs based on GaN HEMTs are reported from lower frequency bands, 5‐13 to X ‐ and Ku ‐bands, 14‐16 and even upper bands 17 …”
Section: Introductionmentioning
confidence: 99%
“…Moreover, their long lifetime and ease of maintenance make the design of high-power amplifiers using single GaN-HEMT bare-dies possible and hence make them the right candidate for space applications. [1][2][3][4] Since then, numerous SSPA designs based on GaN HEMTs are reported from lower frequency bands, [5][6][7][8][9][10][11][12][13] to X-and Ku-bands, [14][15][16] and even upper bands. 17 Different technologies, such as monolithic microwave integrated circuits (MMICs), and hybrid integration techniques based on bare-dies have been used for the realization of high-frequency SSPAs.…”
Section: Introductionmentioning
confidence: 99%