Abstract:The real-time temperature prediction of chips is a critical issue in the semiconductor field. As chip designs evolve towards 3D and high integration, traditional analytical methods such as finite element software and HotSpot face bottlenecks such as high difficulty in modeling, costly computation, and slow inference speeds when dealing with large-scale, multi-hotspot chip thermal analysis. To address these challenges, this paper proposes a real-time temperature prediction model for multi-core chips based on Gr… Show more
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