Reactivity of Cu with poly(tetrafluoroethylene) and poly(vinyl chloride): Effect of pre- and post-metallization modification on the metal/polymer interface

Abstract

The reactivity of Cu with poly(tetrafluoroethylene) (PTFE) and poly(vinylchloride) (PVC) during thermal evaporation, as well as the effect of pre- and post-metallization Ar+ ion and x-ray mediated surface modification treatments on the metal/polymer interface, have been studied using in situ x-ray photoelectron spectroscopy (XPS) and ex situ atomic force microscopy (AFM). During thermal evaporation, copper was unreactive on PTFE but reacted with PVC to form CuCl. Pretreatment of PTFE or PVC surfaces by Ar+ ion or x-ray irradiation did not modify the chemical reactivity of the polymer surface during subsequent Cu deposition, although significant morphological changes were observed on PTFE by AFM. In contrast, post-metallization modification of the Cu/PTFE interface by Ar+ ion or x-ray irradiation lead to the production of CuF2, and increased the yield of CuCl in the Cu/PVC system. In either the Cu/PTFE or Cu/PVC systems, the maximum concentration of copper halide formed and dependence upon treatment time was found to be similar for either Ar+ ion or x-ray irradiation post-metallization treatment strategies, suggesting a common reaction mechanism.

Electron Induced Surface Reactions of Organometallic Metal(hfac)2 Precursors and Deposit Purification

“…Another example is the nature of the gas phase species produced when adsorbed Cu II (hfac) 2 molecules were exposed to electron irradiation (compare Figure S3 in the Supporting Information and Figure a,ii). The one notable difference between the three metal II (hfac) 2 complexes is the Cu II (hfac) 2 precursor, where the electron stimulated loss of C–F bonds in the F­(1s) region was accompanied by the appearance of a distinct new peak that can be identified as a fluoride ion (Figure ). , The appearance of a fluoride (F – ) species can be understood by considering that electron irradiation of adsorbed Cu II (hfac) 2 molecules creates reduced Cu species while at the same time also liberating reactive F – ions from C–F bond cleavage. Reactions between these two species produce a stable copper fluoride.…”

“…Over the past several years, we have developed an ultrahigh vacuum (UHV), surface science approach to acquire more detailed molecular level information on the EBID process. ,− These surface science studies on adsorbed organometallic precursors represent an increasing level of complexity compared to gas phase studies and provide a bridge between information that can be obtained from typical EBID studies, primarily conducted in electron microscopes, and data on the reactions of electrons with isolated precursor molecules in the gas phase. Thus, UHV surface science studies can track the electron-stimulated decomposition of organometallic precursors in situ, identify the volatile species created during deposition, and study the effects of post-deposition purification strategies.…”

Ion beam induced surface and interface engineering

“…The reactivity of Cu with PTFE and PVC during thermal evaporation, as well as the effect of pre-and post-metallization Ar + ion treated surface modification on the metal/polymer interface, have been studied by Perry et al [492]. During thermal evaporation, copper was unreactive on PTFE but reacted with PVC to form CuCl.…”