2021
DOI: 10.1016/j.biosystems.2020.104304
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Reactive fungal wearable

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Cited by 56 publications
(35 citation statements)
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“…So far, Ecovative has demonstrated that lignocellulosic CMM can be a viable alternative to replace expanded polystyrene packaging [ 74 ]. Mycelium was also shown to be an interesting support material for electronic circuit boards instead of commonly used acrylic plastics or as e-textiles and reactive fungal wearables [ 75 – 77 ]. Mycelium material properties that are appreciated features for electronic support applications are their heat and thermal resistance, light weight, modulable shape and hydrophobic nature [ 75 ].…”
Section: Three Areas Ripe For Developmentmentioning
confidence: 99%
“…So far, Ecovative has demonstrated that lignocellulosic CMM can be a viable alternative to replace expanded polystyrene packaging [ 74 ]. Mycelium was also shown to be an interesting support material for electronic circuit boards instead of commonly used acrylic plastics or as e-textiles and reactive fungal wearables [ 75 – 77 ]. Mycelium material properties that are appreciated features for electronic support applications are their heat and thermal resistance, light weight, modulable shape and hydrophobic nature [ 75 ].…”
Section: Three Areas Ripe For Developmentmentioning
confidence: 99%
“…We demonstrated that hemp pads colonised by the fungus P. ostreatus (Fig. 6(a)) show distinctive sets of responses to chemical stimulation [11,32]. We stimulated colonised hemp pads with 96% ethanol, malt extract powder (Sigma Aldrich, UK) dissolved in distilled water, dextrose (Ritchie Products Ltd, UK) and hydrocortisone (Solu-Cortef trademark, 4 mL Act-O-Vial, Pfizer, Athens, Greece).…”
Section: Fungal Chemical Sensormentioning
confidence: 99%
“…32 − 37 More recently, we have demonstrated a reactive fungal wearable made out of Pleurotus ostreatus mycelium. 38 …”
Section: Introductionmentioning
confidence: 99%