1994
DOI: 10.1007/bf00323304
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Reactive diffusion in Pd/Ni/CuSn6 layer systems at 500�C

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Cited by 3 publications
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“…Increased temperatures during the production of bimetals or the resistance heating of the contact, when it is in use, cause diffusion processes. As a consequence, the formation of brittle intermetallic phases starting at the plating plane is possible, and the long-time stability of the electric contact can be strongly affected [1].The results presented in this paper are part of an investigation on diffusion processes in precious metal layer systems [2][3][4] zones and identification of intermetallic phases played an important role. Usually x-ray diffraction is one of the most applied methods for phase analysis, but its applicability is limited, when analysing multiphase mixtures [-5].…”
mentioning
confidence: 97%
“…Increased temperatures during the production of bimetals or the resistance heating of the contact, when it is in use, cause diffusion processes. As a consequence, the formation of brittle intermetallic phases starting at the plating plane is possible, and the long-time stability of the electric contact can be strongly affected [1].The results presented in this paper are part of an investigation on diffusion processes in precious metal layer systems [2][3][4] zones and identification of intermetallic phases played an important role. Usually x-ray diffraction is one of the most applied methods for phase analysis, but its applicability is limited, when analysing multiphase mixtures [-5].…”
mentioning
confidence: 97%