2013
DOI: 10.1007/s10853-013-7592-2
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Reaction zone formed during diffusion bonding of TiNi to Ti6Al4V using Ni/Ti nanolayers

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Cited by 39 publications
(30 citation statements)
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“…This approach does not require a braze or solder insert and often uses the multilayer as a "reactive filler". High strengths have been obtained when using Ni/Ti, Ni/Al, and Ti/Al multilayers [239,241,242,245].…”
Section: Joiningmentioning
confidence: 99%
“…This approach does not require a braze or solder insert and often uses the multilayer as a "reactive filler". High strengths have been obtained when using Ni/Ti, Ni/Al, and Ti/Al multilayers [239,241,242,245].…”
Section: Joiningmentioning
confidence: 99%
“…In recent years, several unconventional bonding techniques and even novel approaches have been intensively investigated [9][10][11][12][13][14][15][16][17][18]. These new approaches have been pointed out as being the best solution for dissimilar bonding of titanium alloys to other materials.…”
Section: Introductionmentioning
confidence: 99%
“…1,2 TiNi thin films have been successfully applied to sensors, actuators, and microvalves in microelectromechanical systems [3][4][5][6] and medical implants in human body. 7,8 The intrinsic disadvantage in manufacturing TiNi alloys is that they respond slowly to the deformation due to their limitation in the cooling ratio, whereas manufacturing TiNi alloys in thin films can dramatically minimize the disadvantage.…”
Section: Introductionmentioning
confidence: 99%