2020
DOI: 10.1002/mame.201900820
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Rational Design of Soluble Polyaramid for High‐Efficiency Energy Storage Dielectric Materials at Elevated Temperatures

Abstract: High‐temperature polymer dielectrics are in great demand for harsh‐environment applications. Maintaining high‐energy storage density and low loss at elevated temperatures remains a major challenge for polymer dielectrics. In this work, a new type of polymer dielectric material is designed, which exhibits comparable dielectric properties in the start‐of‐the‐art dielectric nanocomposites and a superior potential for scale up. A soluble, glassy state polymer with a polarizing group is designed by introducing a we… Show more

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Cited by 44 publications
(27 citation statements)
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“…Recently, another flexible linkage -ether ketone was introduced into the aromatic polyamide (PA) backbone to afford soluble poly(naphthalene ether ketone amide) (PEKNA). 140 This is to address the issue that PAs are notoriously difficult to be processed into highquality thin films because of their rigid main chain structure and high density of interchain hydrogen bond. Specifically, as shown in Fig.…”
Section: Aromatic Backbone Structure Consisting Of Ether Linkagesmentioning
confidence: 99%
“…Recently, another flexible linkage -ether ketone was introduced into the aromatic polyamide (PA) backbone to afford soluble poly(naphthalene ether ketone amide) (PEKNA). 140 This is to address the issue that PAs are notoriously difficult to be processed into highquality thin films because of their rigid main chain structure and high density of interchain hydrogen bond. Specifically, as shown in Fig.…”
Section: Aromatic Backbone Structure Consisting Of Ether Linkagesmentioning
confidence: 99%
“…Xu et al. [ 108 ] obtained a poly(naphthalene ether ketone amide) (PEKNA) via Yamazaki phosphorylation polymerization. They revealed that the mobility of molecular dipoles could be enhanced by introducing a weakly polar group into the main chain of PA to weaken the hydrogen bonds between the amides.…”
Section: Dielectric Polymers For Film Capacitorsmentioning
confidence: 99%
“…[ 113 ] A relatively high discharge energy density of 1.5 J cm −3 can be achieved for PEI even at a high temperature of 150 °C, which is about twice higher than that of PI. [ 108 ] More recently, Tuncer et al. [ 114 ] investigated the non‐parametric dielectric response of the PEI via a numerical inversion algorithm to solve the relaxation time distribution of the PEI films with a thickness of 5 µm.…”
Section: Dielectric Polymers For Film Capacitorsmentioning
confidence: 99%
“…The charge-discharging efficiency of the PEKNA material reached 86.8% at 200°C. [29] Ren et al reported a nanocomposite consisting of a PEI substrate with hafnium oxide (HfO 2 ) nanoparticles to achieve an energy density of 2.82 J cm −3 at 150°C. [30] A hightemperature dielectric energy storage material was prepared by adding montmorillonite (MMT) nanosheets to the PAI polymer, which exhibited an energy density of 3.6 J cm −3 at a temperature of 150°C.…”
Section: Introductionmentioning
confidence: 99%
“…The charge–discharging efficiency of the PEKNA material reached 86.8% at 200 °C. [ 29 ] Ren et al. reported a nanocomposite consisting of a PEI substrate with hafnium oxide (HfO 2 ) nanoparticles to achieve an energy density of 2.82 J cm −3 at 150 °C.…”
Section: Introductionmentioning
confidence: 99%