Rational Design of 3D‐Printed Metastructure‐Based Pressure Sensors

Abstract

Metastructure‐based pressure sensors (MBPS) offer higher sensitivity, broader sensing range, greater design flexibility, and superior performance tunability compared with traditional pressure sensors. Currently, there exists a gap between metastructure architecture design and prediction of sensing performance. To this end, a new design‐to‐manufacturing paradigm is presented. A coupled mechanical‐electrical finite element model is developed to predict sensing performance of systematically designed MBPS. Rapid prototyping by additive manufacturing (AM) is achieved via micro‐digital light processing (μDLP) and atomic layer deposition (ALD) for forming nanoscale conductive coatings. Results indicate that a large sensing range requires high metastructure stiffness, achieved by increasing relative density. However, high sensitivity and reversible sensing range both rely on elastic coating deformation – enforcing a balance between these properties. The trade‐off between sensing range and sensitivity is investigated for structures with different Poisson’s ratios and fillet ratios. Metastructure architecture design can lead to substantial expansion of the sensing range, enabling pressure detection ranging from 0 to 15 MPa (6.23% strain). An impressive sensitivity variance of 6.8 times has been observed between the highest and lowest MBPS samples. Finally, we demonstrate how our design framework allows deep electromechanical integration of 3D printed sensors with additively manufactured components, such as a truss bridge.This article is protected by copyright. All rights reserved.