processes with big cost-down potential, which results in a cutting-edge conversion efficiency record of 25.2%. [3] In the device structure of semitransparent PSCs, the superstrate is mostly made of widely used indium-tin oxide (ITO) coated glass, which is called Front-transparent-electrode (FTE) and allows high light transmission and high conductivity. The ITO glass can be purchased directly or produced by depositing ITO films on glass substrates. [4] Compared with ITO based FTEs, rear transparent electrodes (RTE) deposited on the sensitive absorber layer need gentle film deposition because the high deposition temperature of ITO series would damage the underlying active layers in the device. [5-7] To date, various materials combinations were applied to realize effective RTE, [8-10] whereas metal contained RTEs suffer from either high interfacial recombination, low conductivity, or inferior near-infrared T%. [11-13] Neighboring ITO, Indium-zinc oxide (IZO) owns high mobility and low Urbach energy, especially room temperature for deposition, [14-16] which meet the abovementioned requirement of RTE. To date, IZO has been successfully adopted as RTE in PSCs for tandem devices. [17-28] Most of them were deposited by the sputtering process. However, the energetic bombardment in the sputtering process would damage the surface of the underlying carrier transport layer (CTL), and hence increase dangling bonds and trap density, resulting in interfacial recombinations in the device and finally deteriorate the device performance. [29] Among them, the introduction of buffer layer, including MoO x , [30-32] SnO x , [33-36] ZnO x , [37-40] and so on, [41-43] at the interface between IZO and CTL seems a reluctant choice to prevent the underlying CTL from the damage in the IZO deposition process. Undoubtedly, the additional buffer layer definitely increases the series resistance, resulting in some parasitic absorption and interfacial recombinations, which would deteriorate the device performance. [44-46] Meanwhile, the deposition of the buffer layer would also complicate the manufacturing process and increase the operation cost. Thereby, it is necessary to develop the direct contact of IZO/CTL without the buffer layer, as well as its corresponding fabrication process.