Abstract:Rapid Thermal Processing (RTP) is currently well established at the < 0.5 μm nodes for implant anneal and suicide formation/anneal in logic applications. Rapid Thermal Chemical Vapor Deposition (RTCVD) is being evaluated to deposit thin nitride for the DRAM storage node dielectric. A combination RTP/RTCVD has been evaluated in the form of a cluster tool to evaluate 60 Å gate oxides. These applications of RTP are considered to be process enabling because of either improved temperature ramp control or ambient… Show more
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