Rapid synthesis of irregular sub-micron flaky silver with high flake-particle ratio: Application to silver paste

Chao, Yunxiu; Yang, Hongwei; Li, Yuxiu; Guo, Shuailong; Wang, Cheng; Wang, Chuan

doi:10.1016/j.cplett.2018.08.021

Cited by 12 publications

(3 citation statements)

References 23 publications

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“…These advancements have led to their widespread use in applications. Conductive silver paste offers several advantages, including excellent electrical conductivity, good adhesion to various substrates, low resistance, and high thermal conductivity [16,17]. However, conductive silver paste has some disadvantages; silver can oxidize over time, especially when exposed to air, moisture, or certain environmental conditions.…”

Section: Introductionmentioning

confidence: 99%

“…Additionally, graphite powder is another conductive material that is often used in combination with metals or as a standalone conductive component in conductive pastes. These powder particles are typically micro-or nano-scale in size to enhance conductivity and allow for better adhesion to substrates [6,16,17,20,21]. (2) The polymer adhesive serves as a binder that holds the metal powder particles together and facilitates their adhesion to the substrate.…”

Section: Introductionmentioning

confidence: 99%

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Electrical and water resistance properties of conductive paste based on gold/silver composites

WONGRERKDEE,

CHOOPUN,

PIMPANG

2023

J Met Mater Miner

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This study aimed to investigate the effects of a corrosive environment on both the electrical and the water resistance properties of conductive paste based on gold/silver composites. The conductive paste was prepared by incorporating silver and gold powders, polyvinyl acetate, polyvinyl chloride as adhesive components, and methyl isobutyl ketone as a diluent. The gold/silver composite powder was prepared with different mass ratios of gold and silver. The paste was coated on a substrate and heated at 80℃ to form the conductive paste film. Characterizations of conductive paste were performed by using FT-IR spectroscopy, electrometry, cyclic voltammetry, and contact angle measurements. Thus, the conductive paste films were tested under two conditions: the absence and the presence of exposure to nitric acid vapor. The results showed that the resistance and the contact angle of the conductive paste were more stable after exposure to nitric acid vapor, particularly in samples of higher gold content. Furthermore, the electrochemical behavior of the conductive paste with gold content remains unchanged after exposure to nitric acid vapor. Results suggest that gold has properties in terms of stability, resistance to oxidation, and maintaining surface characteristics, making it a preferable component for applications requiring resistance to corrosive environments.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Electrical and water resistance properties of conductive paste based on gold/silver composites

WONGRERKDEE,

CHOOPUN,

PIMPANG

2023

J Met Mater Miner

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“…It appears that 2-D shaped metal particles are a missing material for solution-processed top-contact electrodes. Ag nanoplates (AgNLs) are typical 2-D metal particles with controllable morphology, , but solution-processed electrodes using AgNL-based inks and pastes have been much less reported − than those based on AgNPs and AgNWs. Ag microplates (AgMLs) with lateral sizes of several micrometers have also appeared. − Face-to-face contact of large AgMLs is anticipated to enhance the electrical conductivity of solution-processed AgML films, but such contact is hampered by surface-protecting insulating molecules. , To our knowledge, the low-temperature fusing phenomenon has appeared on the nanoscale only and has not been disclosed in micrometer-scale AgMLs.…”

Section: Introductionmentioning

confidence: 99%

Low-Temperature Edge-Fusing Phenomenon of Silver Microplates and Solution-Processed Low-Resistivity Top-Contact Electrodes

Furusawa

Ando

Daiguji

et al. 2022

ACS Appl. Electron. Mater.

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The formation of low-temperature solution-processed electrodes from cost-effective and abundant materials is expected to realize all-solution-processed film devices. Silver microplates (AgMLs) can replace metal electrodes formed via high-energy and high-material-consuming processes such as vacuum-evaporation deposition; however, the intrinsic potentials of AgMLs have remained veiled, limiting both industrial applications and scientific research. Here, AgMLs with lateral growth to 3 μm are prepared and filtered through their aqueous dispersion solution on a polytetrafluoroethylene membrane. Assisted by the solvent wettability and flexibility of the membrane, a face-to-face stacked AgML film forms on the membrane and adheres to a glass plate without any external pressure. The film spontaneously transfers onto the plate after the wet solvent evaporates. A low-temperature edge-fusing phenomenon of AgMLs is discovered. Thermogravimetric analysis–synchronized mass spectroscopy reveals that edge fusion is induced from the {100} surfaces of AgMLs by catalytic N–C bond cleavage, which triggers low-temperature decomposition of the surface-protecting polyvinylpyrrolidone at ≤200 °C. The edge fusion markedly improves the volume resistivity of the AgML film to single digits (∼7 μΩ cm), but the resistivity is still higher than 1.6 μΩ cm in bulk silver. We also mention a solvent-compatible method for transferring a AgML film onto solvent-sensitive perovskite materials such as CH3NH3PbI3 and CsPbBr3.

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Modulation of Surface Oxygen Defects on ZnO/ZnS Catalysts to Promote Photocatalytic H₂ Production

Wang

Zeng

et al. 2022

ChemistrySelect

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Zinc oxide/zinc sulfide (ZnO/ZnS) microparticles with enriched surface oxygen defects (D so ) were prepared via a hydrothermal sulfurization modulated by doping sliver/copper ions (Ag + / Cu 2 + ). Microsized ZnO precursors with different structures were firstly prepared in the presence of Ag + /Cu 2 + . A subsequent surface sulfurization of the precursor led to the formation of ZnS nanostructure, forming ZnO/ZnS with modulated D so simultaneously. In addition, this in-situ sulfurization ensured the homogeneous distribution of Ag/Cu species with ZnO/ZnS (ACZS), which significantly improved the electric conductivity of these hybrid materials. Because of the structural, compositional, and defect features, the ACZS6 sample delivered a maximum photocatalytic hydrogen (H 2 ) production rate of 769 μmol g À 1 h À 1 with almost 100 % of rate retention even after 9 h under UV-vis light. Thus, this study may provide an efficient strategy to engineering oxygen defects within microsized photocatalysts for H 2 production.

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Rapid synthesis of irregular sub-micron flaky silver with high flake-particle ratio: Application to silver paste

Cited by 12 publications

References 23 publications

Electrical and water resistance properties of conductive paste based on gold/silver composites

Electrical and water resistance properties of conductive paste based on gold/silver composites

Low-Temperature Edge-Fusing Phenomenon of Silver Microplates and Solution-Processed Low-Resistivity Top-Contact Electrodes

Modulation of Surface Oxygen Defects on ZnO/ZnS Catalysts to Promote Photocatalytic H₂ Production

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Rapid synthesis of irregular sub-micron flaky silver with high flake-particle ratio: Application to silver paste

Cited by 12 publications

References 23 publications

Electrical and water resistance properties of conductive paste based on gold/silver composites

Electrical and water resistance properties of conductive paste based on gold/silver composites

Low-Temperature Edge-Fusing Phenomenon of Silver Microplates and Solution-Processed Low-Resistivity Top-Contact Electrodes

Modulation of Surface Oxygen Defects on ZnO/ZnS Catalysts to Promote Photocatalytic H2 Production

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Modulation of Surface Oxygen Defects on ZnO/ZnS Catalysts to Promote Photocatalytic H₂ Production