Rapid fabrication of SERS substrate and superhydrophobic surface with different micro/nano-structures by electrochemical shaping of smooth Cu surface

Preparation of an ultra-low profile and high peel strength copper foil with rice-grain microstructures

“…When the surface of the copper foil is rice-grain copper nanoparticles, the contact angle of diiodomethane on RG-VLP is 88.3°, while the contact angle on the VLP surface is 63.2°. According to the Cassie–Baxter model, 22–24 the contact angle can be defined as the angle between the tangent of a boundary droplet and the plane of a solid surface. The droplet–gas–solid interface relationship can be obtained as solid surface wettability using the following formula.cos θ CA = f s (cos θ flat + 1) − 1where θ CA and cos θ flat denote the contact angle between a rough solid surface and an ideal smooth surface droplet, respectively, and f s denotes the ratio of the solid surface vs. the droplet contact.…”

Electrochemical Preparation of Ni-Mo Coated Coral-Like Cu Micro-Arrays for Electrocatalytic Hydrogen Evolution Reaction in Acidic Solution

“…-Before fabrication, the copper disk electrode (2 mm diameter, purity ≥99.8%) was successively polished with 2000 mesh sandpaper and α-alumina powders (500 nm) to a mirror-like surface, and cleaned ultrasonically three times each for 3 min in Millipore water. Then the smooth copper electrode was placed upwards in 1 M (mol dm −3 ) H 2 SO 4 solution, and electrochemically treated by SWPPs between 0 V and −1.4 V with a frequency of 50 Hz for 40 s. A higher frequency than our previously adopted one (10 Hz) 25 is more effective to fabricate coral-like Cu micro-arrays.…”