Rapid Electrical Sintering of Nanoparticle Stuctures

Alastalo, Ari; Mattila, T.; Allen, Mark; Aronniemi, Mikko; Leppäniemi, Jaakko; Ojanperä, Kimmo; Suhonen, Mika; Seppä, Heikki

doi:10.1557/proc-1113-f02-07

Cited by 17 publications

(18 citation statements)

References 6 publications

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“…The conductivity of silver track on photo paper obtained with the electrical sintering method, was reported to be more than 50% of bulk silver . While the silver track temperature reached 130 °C, the substrate temperature stayed below 60°C . The advantage of this method is the short sintering time (typically <100 msec, although direct contact with a power supplier is necessary, and therefore this method cannot be applied to large area R2R printed electronics …”

Section: Post‐printing Treatment and Resistivitymentioning

confidence: 99%

Conductive Nanomaterials for Printed Electronics

Kamyshny

Magdassi

2014

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760

626

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This is a review on recent developments in the field of conductive nanomaterials and their application in printed electronics, with particular emphasis on inkjet printing of ink formulations based on metal nanoparticles, carbon nanotubes, and graphene sheets. The review describes the basic properties of conductive nanomaterials suitable for printed electronics (metal nanoparticles, carbon nanotubes, and graphene), their stabilization in dispersions, formulations of conductive inks, and obtaining conductive patterns by using various sintering methods. Applications of conductive nanomaterials for electronic devices (transparent electrodes, metallization of solar cells, RFID antennas, TFTs, and light emitting devices) are also briefly reviewed.

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Section: Post‐printing Treatment and Resistivitymentioning

confidence: 99%

Conductive Nanomaterials for Printed Electronics

Kamyshny

Magdassi

2014

Small

760

626

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“…Hence, it can be • Melting point: 1234.93 K [26] • Excellent electrical conductivity, thermal conductivity, and oxidation stability [21,27,28] • Unique optical, plasmonic, and antibacterial properties [21,54] • Tunable optical, electrical, and chemical properties [55] • Exhibits surface plasmon resonance (SPR) effects [5,50] • Patch antennas [51] • 3D antennas [52] • RFID tags [53] • Thermal sintering [48,49,157] • Laser sintering [158] • Intense pulse light (IPL) sintering [57,58] • Infrared (IR) sintering [159] • Ultraviolet (UV) sintering [59] • Microwave sintering [160] • Plasma sintering [161] • Electrical sintering [162] • Sintering temperatures ranging from 100 to 300 °C [31,48,49,157] • 3 µΩ cm after 10 min of thermal sintering at 200 °C (UTDAgTE) [157] • 8 µΩ cm after 60 min of thermal sintering at 140 Although they are highly suitable for formulating highly conductive metallic nanoparticle inks, their melting temperatures are considerably high also.…”

Section: Comparison Of Different Metallic Nanoparticle Inks Used In 3mentioning

confidence: 99%

Metallic Nanoparticle Inks for 3D Printing of Electronics

Tan

Chua

et al. 2019

Adv Elect Materials

197

100

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Metallic nanoparticle inks are readily obtainable from the commercial market and are commonly used for fabricating conductive tracks and patterns due to their relatively higher electrical conductivity as compared to other types of inks. These metallic nanoparticle inks are made up of electrically conductive metallic nanoparticles suspended in liquid mediums, with particle size ranging from 1 to 100 nm. However, there are also diverse types of metallic nanoparticle inks in the market (for instance, silver nanoparticle inks, gold nanoparticle inks, and copper nanoparticle inks). Metallic nanoparticle inks of different material compositions can directly influence the final electrical, material, and mechanical properties of the printed patterns. This paper presents an overview of the different types of metallic nanoparticle inks used for the 3D printing of electronics. The strengths and weaknesses of each type of ink are critically reviewed. The challenges and potentials of metallic nanoparticle inks in 3D printed electronics are also discussed. Metallic Nanoparticle InksMetallic nanoparticle inks are suspensions of metallic nanoparticles in liquid mediums (see Figure 2a), in which individual metallic nanoparticle is encapsulated in a layer of insulating organic additives and stabilizing agents (see Figure 2b). The encapsulating organic additives and stabilizing agents help prevent the metallic nanoparticles from agglomeration, but at the same time, also impede the flow of electrons from particles to particles. Therefore, sintering processes are required to remove The three-dimensional (3D) printed electronics additive manufacturing industry sector has grown substantially in the past few years, and there is increasing demand for different types of metallic nanoparticle inks in electronics printing for various applications. Metallic nanoparticle inks are commonly used for fabricating conductive tracks and patterns due to their relatively high electrical conductivity as compared to other types of inks, and they can be further categorized into single-element metallic nanoparticle inks, alloy metallic nanoparticle inks, metallic oxide nanoparticle inks, and core-shell bimetallic nanoparticle (BNP) inks. It is critical to gain a deep understanding of the metallic nanoparticle inks used in 3D printed electronics as the material properties of these inks can directly affect the final electrical and mechanical properties of the printed patterns. This review presents an overview of the available metallic nanoparticle inks used for 3D printing of electronics, and critically reviews the strengths and weaknesses of each type of ink. Finally, the challenges of metallic nanoparticle inks in 3D printed electronics are also discussed along with the future outlook for 3D printed electronics.

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“…Upon application of an electric field, resistive heating of this network takes place, which drives off any stabilisers and sinters the particles together. This process is very quick (~100 ms), leads to minimal heating of the substrate and leads to conductivity approaching bulk metal [124], but requires a direct connection to a power source, which would potentially be a limitation in additive manufacturing.…”

Section: Processing Of Metallic Inksmentioning

confidence: 99%

Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality

et al. 2016

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-Additive manufacturing, an umbrella term for a number of different manufacturing techniques, has attracted increasing interest recently for a number of reasons, such as the facile customisation of parts, reduced time to manufacture from initial design, and possibilities in distributed manufacturing and structural electronics. Inkjet printing is an additive manufacturing technique that is readily integrated with other manufacturing processes, eminently scalable and used extensively in printed electronics. It therefore presents itself as a good candidate for integration with other additive manufacturing techniques to enable the creation of parts with embedded electronics in a timely and cost effective manner. This review introduces some of the fundamental principles of inkjet printing; such as droplet generation, deposition, phase change and post-deposition processing. Particular focus is given to materials most relevant to incorporating structural electronics and how post-processing of these materials has been able to maintain compatibility with temperature sensitive substrates. Specific obstacles likely to be encountered in such an integration and potential strategies to address them will also be discussed.

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Rapid Electrical Sintering of Nanoparticle Stuctures

Cited by 17 publications

References 6 publications

Conductive Nanomaterials for Printed Electronics

Conductive Nanomaterials for Printed Electronics

Metallic Nanoparticle Inks for 3D Printing of Electronics

Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality

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