2010
DOI: 10.2320/matertrans.m2010251
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Rapid Consolidation of Nanostructured TiCu Compound by High Frequency Induction Heating and Its Mechanical Properties

Abstract: Nanosized TiCu powders were synthesized by high energy ball milling of micron-sized Ti and Cu powders. Dense TiCu could be consolidated by high frequency induction sintering method within 1 min using both horizontally milled elemental powders of Ti+Cu and mechanically synthesized powders of TiCu. The consolidation was accomplished under the combined effect of induced current and applied mechanical pressure. The grain size, sintering behavior and hardness of TiCu sintered from both powders were examined.

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Cited by 13 publications
(3 citation statements)
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“…The hardness results are in accordance with the behavior observed by previous investigations where the titanium increase had a positive effect on the hardness value, especially in values higher than 5% [8,42,48]. The studies carried out by Akbarpour et al [20] present a close reference to the hardness values found in the composites, despite the need for an aging process in order to promote intermetallic growth and the elimination of the thermal stress of the sintering to the extent that ideal values proposed by Shon et al [49]. Finally, despite the observations of pores at 850°C had been observed that their presence does not significantly deteriorate the hardness of the study system as pointed out by Zhao et al [50].…”
Section: Microhardness Of the Materialsupporting
confidence: 91%
“…The hardness results are in accordance with the behavior observed by previous investigations where the titanium increase had a positive effect on the hardness value, especially in values higher than 5% [8,42,48]. The studies carried out by Akbarpour et al [20] present a close reference to the hardness values found in the composites, despite the need for an aging process in order to promote intermetallic growth and the elimination of the thermal stress of the sintering to the extent that ideal values proposed by Shon et al [49]. Finally, despite the observations of pores at 850°C had been observed that their presence does not significantly deteriorate the hardness of the study system as pointed out by Zhao et al [50].…”
Section: Microhardness Of the Materialsupporting
confidence: 91%
“…12 Among Cu-based matrices, TiCu intermetallic compounds are advanced materials that have high electric conductivity along with high hardness that can be as high as 765 HV, depending on the processing method and phase composition. 13,14 Potential applications of TiCu-based hard materials include biomedical applications, including dental bridge and frameworks, as well as orthopedic implants. 1517 Moniri Javadhesari et al.…”
Section: Introductionmentioning
confidence: 99%
“…Titanium–copper alloys and intermetallic compounds are advanced technological materials because of some attractive properties such as high electrical and thermal conductivity, a combination of strength, ductility and good fatigue resistance [1-6]. Apart from it, these alloys can find application as biomaterials since they exhibit high antibacterial activity, good cell biocompatibility and good mechanical, wear and friction properties playing a very important role in their clinical application [5-8].…”
Section: Introductionmentioning
confidence: 99%