Rapid and complex dynamics of through glass via formation using a picosecond quasi-continuous wave laser as revealed by time-resolved absorptance measurements and multiphase modeling

Schrauben, Joel N.; Matsumoto, Hisashi; Lin, Zhibin; Kleinert, Jan

doi:10.1007/s00339-023-06526-z

Cited by 2 publications

(4 citation statements)

References 30 publications

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“…Mechanical techniques including the abrasive jet machining method make it difficult to form vias less than 100 µm in diameter. In contrast, laser ablation presents an effective means of creating low diameter and high depth-to-width ratio vias by forming micro-vias through thermal shock and ablation [ 57 , 58 , 59 , 60 , 61 , 62 , 63 , 64 , 65 , 66 , 67 , 68 ]. Lasers have widespread applications in cutting and drilling various materials, including PCB substrates.…”

Section: Through Glass Vias’ Formation and Metallization Techniquesmentioning

confidence: 99%

“…The absorption rate of glass in the visible range is low, so UV and IR lasers prove to be more efficient for glass processing [ 67 ]. However, even within the visible range, ultrashort pulsed lasers such as picosecond and femtosecond lasers can be used to create vias by enhancing the absorption of glass through multiphoton absorption.…”

Section: Through Glass Vias’ Formation and Metallization Techniquesmentioning

confidence: 99%

“…The processing speed of picosecond lasers is 500 times faster than that of CO 2 lasers, reaching 10 m/s. After a latency period of about 1 µs, the glass reaches the threshold temperature by multiphoton absorption, at which the irradiated material is rapidly heated by linear absorption to form vias with a diameter of 10–20 µm [ 67 ]. Using liquid-assisted laser processing, CO 2 lasers are capable of producing arrays of vias ranging from 100 to 200 µm without any crack or burn zones when operated at 6 W power with a scanning speed of 11.4 mm/s [ 57 ].…”

Section: Through Glass Vias’ Formation and Metallization Techniquesmentioning

confidence: 99%

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Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Yu,

Wu,

Zhong

et al. 2023

Sensors

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Glass has emerged as a highly versatile substrate for various sensor and MEMS packaging applications, including electromechanical, thermal, optical, biomedical, and RF devices, due to its exceptional properties such as high geometrical tolerances, outstanding heat and chemical resistance, excellent high-frequency electrical properties, and the ability to be hermetically sealed. In these applications, Through Glass Via (TGV) technology plays a vital role in manufacturing and packaging by creating electrical interconnections through glass substrates. This paper provides a comprehensive summary of the research progress in TGV fabrication along with its integrations, including through via formation and metallization. This paper also reviews the significant qualification and reliability achievements obtained by the scientific community for TGV technology. Additionally, this paper summarizes the application of TGV technology in various sensors such as MEMS sensors and discusses the potential applications and future development directions of TGV technology.

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Section: Through Glass Vias’ Formation and Metallization Techniquesmentioning

confidence: 99%

Section: Through Glass Vias’ Formation and Metallization Techniquesmentioning

confidence: 99%

Section: Through Glass Vias’ Formation and Metallization Techniquesmentioning

confidence: 99%

See 1 more Smart Citation

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Yu,

Wu,

Zhong

et al. 2023

Sensors

View full text Add to dashboard Cite

show abstract

“…Mechanical techniques including the abrasive jet machining method make it difficult to form vias less than 100 µm in diameter. In contrast, laser ablation presents an effective means of creating low diameter and high depth-to-width ratio vias by forming microvias through thermal shock and ablation [57][58][59][60][61][62][63][64][65][66][67][68]. Lasers have widespread applications in cutting and drilling various materials, including PCB substrates.…”

Section: Laser Ablation (Ld)mentioning

confidence: 99%

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Yu,

Wu,

Zhong

et al. 2023

Preprint

View full text Add to dashboard Cite

Glass has emerged as a highly versatile substrate for various sensor and MEMS packaging applications, including electromechanical, thermal, optical, biomedical, and RF devices, due to its exceptional properties such as high geometrical tolerances, outstanding heat and chemical resistance, excellent high-frequency electrical properties, and the ability to be hermetically sealed. In these applications, Through-Glass-Via (TGV) plays a vital role in manufacturing and packaging by creating electrical interconnections through glass substrates. This paper provides a comprehensive summary of the research progress in TGV fabrication along with their integrations, including through-via formation and metallization. The paper also reviews the significant qualification and reliability achievements obtained by the scientific community for TGV. Additionally, the paper summarizes the application of TGV technology in various sensors.

show abstract

Rapid and complex dynamics of through glass via formation using a picosecond quasi-continuous wave laser as revealed by time-resolved absorptance measurements and multiphase modeling

Cited by 2 publications

References 30 publications

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

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