Random vibration fatigue life analysis of electronic packages by analytical solutions and Taguchi method

Gharaibeh, Mohammad A.; Pitarresi, James M.

doi:10.1016/j.microrel.2019.113475

Cited by 27 publications

(22 citation statements)

References 41 publications

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“…When attached to a machine structure, circuit boards can undergo various vibrating forces. Statistics show that about 20% of airborne electronic equipment failures occur due to vibration factors [2]. Damage, or even total failure, can occur when shock and vibration produce high stress on substrate, components, and joints.…”

Section: Introductionmentioning

confidence: 99%

Experimental and Numerical Simulation Study of the Vibration Properties of Thin Copper Films Bonded to FR4 Composite

Azam

Fragoso

2020

Applied Sciences

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Printed circuit boards constitute the basis of most electronic devices and are mainly fabricated of thin copper films bounded to fiber epoxy laminates, such as FR4. Vibrational stress can induce device failure, and hence, studies addressing their modal properties have important applications. In this paper, cantilever samples made of bare copper bounded to FR4 have been studied to analyze, for the first time, the vibration behavior of specimens with different aspect ratios, with and without central holes of different diameters. Natural frequencies and damping ratios were determined experimentally and analytically using a finite element method for four groups of samples with a very good correspondence between both methods. The fundamental resonance frequency of all the specimens was found to be less than 40 Hz and the influence of a central hole was not significant to affect the modal properties.

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Section: Introductionmentioning

confidence: 99%

Experimental and Numerical Simulation Study of the Vibration Properties of Thin Copper Films Bonded to FR4 Composite

Azam

Fragoso

2020

Applied Sciences

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“…The researches on the characterization and degradation modeling of solder joint health under vibration load mainly adopt environmental stress tests and numerical simulation. Since the environmental stress test can directly obtain the state monitoring signal reflecting the failure process of the solder joint, it is more helpful to study the failure characterization and degradation modeling of the solder joint [7], [8]. This paper also uses the environmental stress test to study the solder joint failure characterization and degradation modeling.…”

Section: Introductionmentioning

confidence: 99%

Research on Wiener Degradation Model and Failure Mechanism of Interconnect Solder Joints Under Random Vibration Load

et al. 2021

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Electronic packaging solder joints are the key parts of mechanical fixation and electrical interconnection between electronic chips and printed circuit boards, which are prone to failure and lead to electronic device failures under the action of vibration environment stress. In regard to the failure characterization and degradation modeling of electronic packaging solder joints under vibration load, this paper adopts environmental stress tests, builds a vibration failure test platform, designs a vibration load excitation spectrum, and obtains solder joint degradation data under vibration stress; it uses the square root amplitude, form factors, and kurtosis factors to characterize the solder joint degradation process, which effectively identify the solder joint degradation node, and improve the data monotonicity of the solder joint degradation process; the Wiener process is used to build a solder joint multi-stage degradation model. Based on the EM algorithm, the hyperparameters of the degradation model have been optimized, and the universal test of the Wiener degradation model with multiple samples is carried out in accordance with the LB index. The analysis shows that the effectiveness of different samples is as high as 87.5%, which verifies the universality of the Wiener degradation model; Based on the crack morphology subject to the solder joint test and the features of the solder joint in the multi-stages, the paper analyzes the crack propagation behavior of the solder joint, and clarifies the failure mechanism of the solder joint.

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“…In the field of fatigue analysis due to random vibration, Gharaibeh & Pitarresi, (2019) ;Pitarresi, (1990) and Pitarresi et al, (1991) examined the modelling methods of electronic parts that dominated vibration loading. They looked at lead/solder response and estimated its fatigue life (Yu et al, 2011).…”

Section: Introductionmentioning

confidence: 99%

Random Vibration Fatigue Analysis of Car Roof Luggage Carrier

Gulsevincler¹

2021

European Journal of Science and Technology

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In this paper, random vibration analysis was applied to predict the car roof luggage carrier's fatigue life. Ansys Workbench 19.2 program was used in this study for finite element analysis. The car roof luggage carrier geometry has meshed with 325,536 nodes and 105,682 elements. Random vibration measurements were handled under two different scenarios (vehicle type and road type) and a total of four different driving speeds from previous studies. Random vibration analysis was applied by defining a 75kg load on the car roof luggage carrier applied according to the vibration and PSD data obtained according to the engine, wind, and road conditions of the vehicle, and it was estimated that no fatigue damage would occur for a minimum of 103653 hours using the Steinberg method.

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Random vibration fatigue life analysis of electronic packages by analytical solutions and Taguchi method

Cited by 27 publications

References 41 publications

Experimental and Numerical Simulation Study of the Vibration Properties of Thin Copper Films Bonded to FR4 Composite

Experimental and Numerical Simulation Study of the Vibration Properties of Thin Copper Films Bonded to FR4 Composite

Research on Wiener Degradation Model and Failure Mechanism of Interconnect Solder Joints Under Random Vibration Load

Random Vibration Fatigue Analysis of Car Roof Luggage Carrier

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