1982
DOI: 10.1109/jssc.1982.1051862
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Random errors in MOS capacitors

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Cited by 141 publications
(47 citation statements)
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“…and inverter threshold voltages. As shown in [11], the less the capacitors dimensions, the more the capacity value deviation.…”
Section: Design Methodology Of Mosmentioning
confidence: 99%
“…and inverter threshold voltages. As shown in [11], the less the capacitors dimensions, the more the capacity value deviation.…”
Section: Design Methodology Of Mosmentioning
confidence: 99%
“…Lakshmikumar et al [6] suggest that the higher mismatch of P-channel devices is possibly due to higher mobility variations and poorer gate· oxide capacitance matching. We have no explanation for the non 1/../WL mismatch seal- ing, and attempts to explain the measurements with edge variations (see (1]) or long-range (global) parameter variations (3] have failed.…”
Section: Device Dimensionsmentioning
confidence: 99%
“…Shyu et al [1,2] analyze the effect of edge roughness, surface state and implanted charge fluctuations, oxide thickness variations and mobility fluctuations in terms of short range (local) and long range (global) parameter variations. Pelgrom et al [3] introduce a powerful spatial Fourier transform technique to build a general frame in which different transistor geometries can be accommodated.…”
Section: Introductionmentioning
confidence: 99%
“…It is therefore important that a circuit designer can incorporate these effects in early simulation stage. A variability-aware design approach needs a right prediction of random variations [4][5][6][7]. The investigation and analyze of these variations using accurate 'atomistic' simulations needs both long times and powerful computational resources [1].…”
Section: Introductionmentioning
confidence: 99%