We have fabricated ramp-edge Josephson junctions using a Cu-poor oxide layer as a precursor of the barrier. La 0 2 Y 0 9 Ba 1 9 Cu 3 O (La-YBCO) and La 0 2 Yb 0 9 Ba 1 9 Cu 3 O (La-YbBCO) were used for the base-electrode and the counter-electrode, respectively. A Cu-poor precursor was deposited on a pattered base-electrode at a substrate temperature ( s ) of approximately 660 C by a pulsed laser deposition (PLD) method employing deposition conditions different from those for the counter-electrode layer. The fabricated junctions on a La-YBCO ground plane showed resistively and capacitively shunted junction-type current-voltage characteristics. They exhibited the products of the critical current ( c ) and the junction resistance ( n ) higher than 3 mV and excess current ratio less than 30% at 4.2 K. The c n products were nearly 1.5 times larger than those for junctions with an interface-modified barrier in a temperature range of 4-50 K. The junctions had a barrier region with the thickness of approximately 1 nm and a Cu-poor transition region narrower than that for the latter type of junctions.