Radiation and life test procedures for military and aerospace memory components

A Study on the Reliability Evaluation of a 3D Packaging Storage Module under Temperature Cycling Ultimate Stress Conditions

“…For the qualification tests of microelectronic devices, it is necessary to conduct a range of tests (e.g., physical, temperature, moisture, mechanical, and lifespan tests) in accordance with the procedures and conditions specified in the relevant general specifications, test standards, and product manuals to verify whether the device quality and reliability of products meet the corresponding requirements [2], which is also regraded as an important link in device development and finalization practices. Institutions, such as the National Aeronautics and Space Administration (NASA) and the European Space Agency (ESA), explicitly stipulate that device products that have passed the identification and testing stages should be prioritized in high-reliability applications [3,4]; however, many problems, such as "bad use" and "poor usability", still exist in the devices used during the application process. The main reasons for these problems include the fact that that there is a discrepancy between the standardized test methods and the applications of the devices and technology, and that the device's stress profile cannot meet the demands of all the device application states, especially in extreme environmental applications where the device also experiences various failures [5][6][7].…”