RADC Thermal Guide for Reliability Engineers.

Morrison, Gerald N; Kallis, James M.; Strattan, Landon A.; Jones, Ivan R; Lena, August L

doi:10.21236/ada118839

Cited by 12 publications

(5 citation statements)

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“…It is known that a 10-20°C increase in chip temperature can sometimes double the failure rate of the components. 3 In this study, we observed an asymmetrical thermal behavior of the doped Si channels under high current density stress. Thermal and electrical characterization of the doped Si channels was conducted.…”

Section: Introductionmentioning

confidence: 63%

Asymmetrical heating behavior of doped Si channels in bulk silicon and in silicon-on-insulator under high current stress

Liao¹,

Chen²,

Huang³

et al. 1999

Journal of Applied Physics

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With continuing scaling down in microelectronic devices, the current density and the power consumption in the devices must increase. Hence, device reliability under high current density is an issue for ultralarge-scale integration technology. This study investigates the heating behavior of the heavily doped Si channels under high current stress. Thermal and electrical characterization of the channels in bulk Si and in silicon-on-insulator were conducted. An abnormal asymmetrical heating along the channels in bulk Si has been observed. We propose a junction leakage mechanism to explain the phenomenon observed. Other asymmetrical thermal effects, such as electron-hole recombination and Peltier effect, have also been discussed.

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Section: Introductionmentioning

confidence: 63%

Asymmetrical heating behavior of doped Si channels in bulk silicon and in silicon-on-insulator under high current stress

Liao¹,

Chen²,

Huang³

et al. 1999

Journal of Applied Physics

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“…Those cases are collected in different domains such as computer chassis, avionic facilities. The examples of the flow guidelines are as follows [6,7]:…”

Section: Qualitative Guidelinesmentioning

confidence: 99%

“…As the velocity increased, the static pressure will decrease. High air velocity can result in such a low static pressure at the inlet [6]. When a flow reversal happens, the hot air will then be drawn in from the exit plenum.…”

Section: Qualitative Guidelinesmentioning

confidence: 99%

CAE Supported Ornamental Flame Product Design—Vortex Flow Guiding with Fuel Lift Mechanism

Chen¹

2018

JEPE

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The vortex flame design process was investigated. Combine qualitative and CAE (computer-aided engineering) simulation proposed to fulfill the functional requirement. Guidance channel can produce an ornamental flame with acceptable height. The lift mechanism comprises a supporting member and bearing and allows moving to the predetermined height. It allows a user to add fuel and cleaning base parts safely. Rigid body linkage and flow field simulated enables fine tune of geometric parameters. Functional test and measurement are carried out to confirm the product features. The measured average temperature of the metal chassis is 37.25 °C, and that of glass is 141 °C.

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“…Two important non-automated thermal design resources which designers should be familiar with are References (21 and (3]. As engineers attempt to design devices that operate at higher frequencies and that are smaller, more efficient, precise, sensitive and reliable, while being less expensive, the need to reckon with field electromagnetic effects grows steadily in importance.…”

Section: Tmentioning

confidence: 99%

Introduction to Concurrent Engineering: Electronic Circuit Design and Production Applications

Fuqua¹

1992

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RADC Thermal Guide for Reliability Engineers.

Cited by 12 publications

References 0 publications

Asymmetrical heating behavior of doped Si channels in bulk silicon and in silicon-on-insulator under high current stress

Asymmetrical heating behavior of doped Si channels in bulk silicon and in silicon-on-insulator under high current stress

CAE Supported Ornamental Flame Product Design—Vortex Flow Guiding with Fuel Lift Mechanism

Introduction to Concurrent Engineering: Electronic Circuit Design and Production Applications

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