2001
DOI: 10.3131/jvsj.44.808
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Cited by 3 publications
(3 citation statements)
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“…Details on FTS method and film preparation are described elsewhere [14,18,19]. The base pressure of the sputtering chamber was around 5.0 × 10 − 5 Pa. FeSi 2 (purity: 4 N), Fe (purity: 5 N) and Si (purity: 9 N) targets installed in three separated FTS units were used as sputtering source materials.…”
Section: Methodsmentioning
confidence: 99%
“…Details on FTS method and film preparation are described elsewhere [14,18,19]. The base pressure of the sputtering chamber was around 5.0 × 10 − 5 Pa. FeSi 2 (purity: 4 N), Fe (purity: 5 N) and Si (purity: 9 N) targets installed in three separated FTS units were used as sputtering source materials.…”
Section: Methodsmentioning
confidence: 99%
“…During the initial stage of this study, the IZO films were deposited by facing target sputtering (FTS) because FTS is good for reducing the bombardment of high-energy particles and separating the plasma from the substrate. 8) Figure 3 shows a schematic of FTS. FTS has two facing sputtering targets so that most of the high-energy particles, for example reflected Ar neutrals or negative oxygen ions, move towards a target instead of the substrate.…”
Section: Experimental Methodsmentioning
confidence: 99%
“…It is reported that V 2 O 5 has high performance of hole injection to N,N 0 -diphenyl-N,N-bis(3-methylphenyl)1,1 0 -biphenyl-4,4 0 diamine (TPD) and 4,4 0 -bis[N-(1-naphthyl)-Nphenyl-amino]biphenyl (NPD). 8,10) We considered that V 2 O 5 injects holes to HTL1 as well as TPD because the ionization potential of HTL1 is closer to the work function of V 2 O 5 than to that of TPD, as shown in Table I. The resistance of the HIL is not large, but omitting the HIL was expected to have some effect on decreasing the total resistance of the device.…”
Section: Effect Of V 2 O 5 Buffer Layermentioning
confidence: 99%