Quaternary low melting point Sn-Bi-in-xGa solder with improved mechanical performance for advanced electronic packaging

Qiao, Jingyu; Mao, Xingchao; Xie, Lulin; Xie, Shichen; Tu, King-Ning; Liu, Yingxia

doi:10.1016/j.intermet.2024.108534

Intermetallics

2024

DOI: 10.1016/j.intermet.2024.108534

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Quaternary low melting point Sn-Bi-in-xGa solder with improved mechanical performance for advanced electronic packaging

Jingyu Qiao,

Xingchao Mao,

Lulin Xie

et al.

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Quaternary low melting point Sn-Bi-in-xGa solder with improved mechanical performance for advanced electronic packaging

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References 38 publications

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