Quasi-static analysis of a microstrip via through a hole in a ground plane

Wang, T.; Harrington, Roger F.; Mautz, Joseph R.

doi:10.1109/22.3626

Cited by 127 publications

(48 citation statements)

References 1 publication

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“…A good agreement is achieved between our results and recently published results. This new approach is found to be efficient in producing accurate results with good saving in the computer memory usage and computational time and has the capacity to simulate very large structure with large number of via holes [13][14][15].…”

Section: Discussionmentioning

confidence: 96%

An efficient iterative method for analysis of a substrate integrated waveguide structures

Zairi

Baudrand²,

Gharsallah

et al. 2009

Micro & Optical Tech Letters

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ABSTRACT:The article presents an efficient method for characterization of substrate integrated waveguide structures. Substrate integrated circuits are considered as an ensemble of conducting vias placed in a parallel-plate waveguide. The analysis is based on the wave concept formulation and the iterative resolution of two relationships between incident and reflected volume-waves. The reflection operator is expressed using Hankel functions and computed by considering the scattering from the ensemble of conducting posts. Numerical results have been obtained for substrate integrated waveguide (SIW) structures already presented in literature. Simulations obtained are compared with recent published results. A good agreement is achieved together with significant improvements both in computational time and memory requirements.

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Section: Discussionmentioning

confidence: 96%

An efficient iterative method for analysis of a substrate integrated waveguide structures

Zairi

Baudrand²,

Gharsallah

et al. 2009

Micro & Optical Tech Letters

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“…When vias penetrate a parallel-plane pair, they cannot be modeled as simple lumped circuits as those used in [36], [37]. They excite parallel-plane modes in the plane pair, and the planes are usually electrically large in practical cases.…”

Section: Modeling Noise Coupling In Multilayer High-speed Pcbsmentioning

confidence: 99%

Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology

Fan

Paulis

et al. 2010

IEICE Trans. Commun.

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SUMMARYNoise coupling on the power distribution networks (PDN) or between PDN and signal traces is becoming one of the main challenges in designing above GHz high-speed digital circuits. Developing an efficient and accurate modeling method is essential to understand the noise coupling mechanism and then solve the problem afterwards. In addition, development of new noise mitigation technology is also important for future high-speed circuit systems. In this invited paper, a novel modeling methodology that is based on the physics-based equivalent circuit model will be introduced, and an example of multiple layer PCB circuits will be modeled and validated with good accuracy. Based on the periodic structure concept, several new electromagnetic bandgap structures (EBG), such as coplanar EBG, photonic crystal power layer (PCPL), and ground surface perturbation lattice (GSPL), will be introduced for the mitigation of power/ground noise. The trade/offs of all these structures will be discussed.

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“…The geometry of a long conducting cylinder penetrating a circular aperture in a conducting plane finds practical applications for via structures (Wang et al, 1988;Kok & Zutter, 1991). Electromagnetic wave transmission along a long cylinder penetrating a circular aperture in a conducting plane was considered in Lee and Dudley (1990).…”

Section: Introductionmentioning

confidence: 99%

Static Field by an Infinitely Long Cylinder Penetrating a Circular Aperture

Lee

Eom

2012

Electromagnetics

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An electrostatic problem of a long conducting cylinder penetrating a circular aperture on a conducting plane is solved in this study. The Weber transform and mode matching are utilized to determine the electrostatic potential. The boundary conditions are enforced to obtain series equations for the discrete modal coefficients. Computations are carried out to illustrate the static fields, surface charge densities, and capacitance changes for various geometries.

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Quasi-static analysis of a microstrip via through a hole in a ground plane

Cited by 127 publications

References 1 publication

An efficient iterative method for analysis of a substrate integrated waveguide structures

An efficient iterative method for analysis of a substrate integrated waveguide structures

Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology

Static Field by an Infinitely Long Cylinder Penetrating a Circular Aperture

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