Abstract:In this paper, the design and realization of quasi-elliptical waveguide filters with reduced manufacturing complexity are discussed. The filters are based on TE mode cavities, which are loaded with TM mode stubs. It is shown that dual-, triple-and quadruple-resonance segments are obtained by using up to three stubs loaded on the broad side of a TE mode cavity. The structures obtained can either be used as a stand-alone filter or even as a building block suitable for the realization of higher order filters. The… Show more
“…Figure 13 b show the maximal measured group delay of 0.067 ns and its simulated equivalent of 0.084 ns. The filter provides a solicited flat group delay within the passband, competing with literature 65 , 66 . Figure 13 ( a ) Comparison of full-wave simulation and measurement.…”
To accommodate the ever-growing data requirements in densely populated areas and address the need for high-resolution sensing in diverse next-generation applications, there is a noticeable trend towards utilizing large unallocated frequency bands above 100 GHz. To overcome the harsh propagation conditions, large-scale antenna arrays are crucial and urge the need for cost-effective, mass-manufacturable technologies. A dedicated Any-Layer High Density Interconnect PCB technology for highly efficient wireless D-band (110–170 GHz) systems is proposed. Specifically, the adapted stack accommodates broadband air-filled substrate-integrated-waveguide components for efficient long-range signal distribution and low-loss passives. The viability of the suggested technology platform is demonstrated by designing, fabricating and measuring several essential low-loss air-filled substrate-integrated-waveguide components, such as a dual rectangular filter, with a minimal insertion loss of 0.87 dB and 10 dB-matching within the (132.8–139.2 GHz) frequency band, and an air-filled waveguide with a routing loss of only 0.08 dB/mm and a flat amplitude variation within 0.01 dB/mm over the (115–155 GHz) frequency range. A broadband transition towards stripline, with a limited loss of 1.1 dB, is described to interface these waveguides with compactly integrated chips. A tolerance analysis is included as well as a comparison to the state of the art.
“…Figure 13 b show the maximal measured group delay of 0.067 ns and its simulated equivalent of 0.084 ns. The filter provides a solicited flat group delay within the passband, competing with literature 65 , 66 . Figure 13 ( a ) Comparison of full-wave simulation and measurement.…”
To accommodate the ever-growing data requirements in densely populated areas and address the need for high-resolution sensing in diverse next-generation applications, there is a noticeable trend towards utilizing large unallocated frequency bands above 100 GHz. To overcome the harsh propagation conditions, large-scale antenna arrays are crucial and urge the need for cost-effective, mass-manufacturable technologies. A dedicated Any-Layer High Density Interconnect PCB technology for highly efficient wireless D-band (110–170 GHz) systems is proposed. Specifically, the adapted stack accommodates broadband air-filled substrate-integrated-waveguide components for efficient long-range signal distribution and low-loss passives. The viability of the suggested technology platform is demonstrated by designing, fabricating and measuring several essential low-loss air-filled substrate-integrated-waveguide components, such as a dual rectangular filter, with a minimal insertion loss of 0.87 dB and 10 dB-matching within the (132.8–139.2 GHz) frequency band, and an air-filled waveguide with a routing loss of only 0.08 dB/mm and a flat amplitude variation within 0.01 dB/mm over the (115–155 GHz) frequency range. A broadband transition towards stripline, with a limited loss of 1.1 dB, is described to interface these waveguides with compactly integrated chips. A tolerance analysis is included as well as a comparison to the state of the art.
Only a limited amount of research has been performed on the implementation of air-filled substrate-integratedwaveguide (AFSIW) systems in multi-layer PCB stacks at subterahertz frequencies. In this paper, we investigate the manufacturing reliability and the measurement repeatability based on several measurements of AFSIW transmission lines and three different filters on three separate PCB panels at D-band frequencies (110 GHz-170 GHz). A promising dual-cavity AFSIW filter with a steep roll-off on both sides of the passband is designed, fabricated and measured. The measured insertion loss is around 3 dB, while the out-of-band suppression is better than 30 dB.
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