2020
DOI: 10.3389/fmats.2020.594386
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Quantum Spin-Wave Materials, Interface Effects and Functional Devices for Information Applications

Abstract: With the continuous miniaturization of electronic devices and the increasing speed of their operation, solving a series of technical issues caused by high power consumption has reached an unprecedented level of difficulty. Fortunately, magnons (the quanta of spin waves), which are the collective precession of spins in quantum magnetic materials, making it possible to replace the role of electrons in modern information applications. In the process of information transmission, nano-sized spin-wave devices do not… Show more

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Cited by 7 publications
(5 citation statements)
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“…ref. [59]) as well as enhanced spin Seebeck effect [60]) opens up further opportunities for advanced thin-film LPE technology, which is predestined for the fabrication of multicomponent epitaxial films.…”
Section: B Fabrication Of Nm-thin Yig Films By Liquid Phase Epitaxymentioning
confidence: 99%
“…ref. [59]) as well as enhanced spin Seebeck effect [60]) opens up further opportunities for advanced thin-film LPE technology, which is predestined for the fabrication of multicomponent epitaxial films.…”
Section: B Fabrication Of Nm-thin Yig Films By Liquid Phase Epitaxymentioning
confidence: 99%
“…Such a procedure is much simpler than dealing with complex matrices of Eqs. ( 5) and (6), which need to be dealt with not only for each q but also for every trial energy ω and which are also much bigger, depending on the sampling in r and r .…”
Section: A General Approximation Strategymentioning
confidence: 99%
“…where the electronic Green's function G ↑(↓) (k, s, E) is the Lehmann resummation of Kohn-Sham eigenstates and eigenvalues already appearing in Eq. (6). In practice we adopt the KKR construction to directly obtain these Green functions [51], calculate the Heisenberg exchange parameters J ij [29] and solve the secular equation problem of Eq.…”
Section: A General Approximation Strategymentioning
confidence: 99%
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“…With the miniaturization and integration of power electronics, the increasing operating temperature makes the package module withstand high temperature (Teo and Sun, 2008;Yoon et al, 2013;Chen et al, 2015;Yoon et al, 2019;Xu et al, 2020). Traditional high lead solders are not suitable and needed to be replaced.…”
Section: Introductionmentioning
confidence: 99%