Quantitative auger analysis of copper-nickel alloy surfaces after argon ion bombardment

Structure and chemisorptive properties of the Pt3Ti surface

“…This result can be interpreted in terms of preferential sputtering of Pt atoms. Using the model developed in (18) with the data for relative sputtering cross-sections reported in (19), it can be shown that the bombarded surface composition does not correspond to the equilibrium, but it is 5 enriched in Ti as a result of the sputtering process. From this calculation it appears that the enrichment in platinum of the surface observed upon annealing after sputtering is simply the restoring of the equilibrium composition.…”

Composition of a Clean and Sulphur Covered CuNi(100) Single Crystal Surface

“…The concentration of the element with the lower sputtering yield increases in surface layers and after some time of sputtering it reaches a stationary value. It was shown [18] that the equilibrium surface content of the Cu58Ni42 alloy, was obtained after 10 min. of 500 eV Ar+ bombardment with the current density of 15 pA cm -2 .…”

“…of 500 eV Ar+ bombardment with the current density of 15 pA cm -2 . For an AB alloy, the stationary value of the surface concentration can be evaluated using the simple formula [18,191 where CA and CA are the surface and the bulk concentrations, respectively, expressed in atomic per cent and SA and SB denote the sputtering yields in atom ion-1 , for the A and B components of the binary alloy. The sputtering yield was found to be in a simple relation with the inverse heat of sublimation of the element, so the bond energies between atoms resist the ejection mechanism.…”

“…The sputtering yield was found to be in a simple relation with the inverse heat of sublimation of the element, so the bond energies between atoms resist the ejection mechanism. Several experimental values of sputtering yields for nickel and copper have been presented [18][19][20][21][22] and the sputtering yield ratio, Scu/SNi, of 1.7±0.2 for 0.5=2.0 keV Ar+ ions is the most frequently used value [22]. Introducing the above sputtering yield ratios into Eq.…”

Characteristic Depth Profiles of Surface Layers Formed in Cu-based Alloys by Annealing in Low Partial Pressure of Oxygen

“…In addition, an attention should be paid to atomistic processes in a surface layer during ion sputtering of SIMS measurements. Typically, the surface composition of alloys is known to be influence by ion sputtering, 10,11) and this effect may affect depth profiles. However, it is likely to be short-range …”