Microelectronics Reliability
 2021
DOI: 10.1016/j.microrel.2021.114387
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Quantitative analysis of void initiation in thermo-mechanical fatigue of polycrystalline copper films

Manuel Kleinbichler
1
,
Corinna Kofler
2
,
M. Stabentheiner
3
et al.
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Cited by 6 publications
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References 32 publications
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Intragranular thermal fatigue of Cu thin films: Near-grain boundary hardening, strain localization and voiding

Hlushko
1
,
Ziegelwanger
2
,
Reisinger
3
et al. 2023
Acta Materialia
2
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Intragranular thermal fatigue of Cu thin films: Near-grain boundary hardening, strain localization and voiding

Hlushko
1
,
Ziegelwanger
2
,
Reisinger
3
et al. 2023
Acta Materialia
2
0
0
0
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Al-Cu intermetallic phase growth in hybrid metal extrusion & bonding welds exposed to isothermal annealing or direct current cycling

Sørhaug,
Elkjaer,
Thronsen
et al. 2024
Materials & Design
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Fatigue of copper films subjected to high-strain rate thermo-mechanical pulsing

Moser
1
,
Kleinbichler
2
,
Zechner
3
et al. 2022
Microelectronics Reliability
1
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