Quantifying the Electrical Impact of Bonding Misalignment for 0.5 μm Pitch Hybrid Bonding Structures

Ryan, Kevin; Ip, Nathan; Netzband, Christopher; Chien, Kun-Chieh; Tuchman, Andrew; Huang, Jason; LeFevre, Scott; Son, Ilseok; Aizawa, Hirokazu; Maekawa, Kaoru

doi:10.1109/ectc51529.2024.00216

2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024

DOI: 10.1109/ectc51529.2024.00216

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Quantifying the Electrical Impact of Bonding Misalignment for 0.5 μm Pitch Hybrid Bonding Structures

Kevin Ryan,

Nathan Ip,

Christopher Netzband

et al.

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Quantifying the Electrical Impact of Bonding Misalignment for 0.5 μm Pitch Hybrid Bonding Structures

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References 12 publications

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