Quality Improvement in Flexible Printed Circuit Board (FPCB) Using DMAIC Methodology: An Investigation in Semiconductor Industry

Abstract

Continuous Process Improvement is methodology to solve the defect problem by increasing the effectiveness and efficiency of the business performances. DMAIC (Define-Measure-Analysis-Improve-Control) is a data improvement cycle designed for business process to find flaw or inefficiencies particularly resulting in defect or reject. This study was conducted at Company A and used DMAIC method to reduce the open defect for the circuit on the Flexible Printed Circuit Board (FPCB) from 0.6% to 0.3%. Part 13236 which has the highest open defect problem was chosen as the project improvement main focus. Imaging area was the main focus in this project because of its process forming the circuit. DMAIC methodology are initiated by problem identification through the past record of the open defect. The result observed for period of four months. After improvement, Part 13236 that have the highest defect decrease from 0.68% to 0.28% while the overall open defect decreases from 0.6% to 0.3%. The decline on product defect rate helps the company to improve the effectiveness and efficiency of business performances. It also results in cost saving which improves company’s profit margin in the long term.

FPCB as an Acoustic Matching Layer for 1D Linear Ultrasound Transducer Arrays

“…The wavelength of the ultrasound was calculated by dividing the theoretical speed of sound in the FPCB matching layer by 1 MHz. With these designs, the FPCB matching layer was fabricated by a typical multilayered FPCB fabrication process followed by board cutting, drilling, dry film imaging, developing, etching, stripping, lamination, surface finish, and packaging [ 13 , 14 ]. The manufacturing process was performed on the copper clad laminate (CCL), a fundamental substrate of the FPCB where the polyimide layer was sandwiched by two copper layers.…”