Qualification of Microchip Al Bondpad and Elimination of NSOP

Younan, Hua; Shen, Yue; Goh, Junxian; Kee, Yeh Yee; Li, Xiaomin

doi:10.1109/iemt.2018.8511697

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) 2018

DOI: 10.1109/iemt.2018.8511697

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Qualification of Microchip Al Bondpad and Elimination of NSOP

Hua Younan¹,

Yue Shen²,

Junxian Goh³

et al.

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Qualification of Microchip Al Bondpad and Elimination of NSOP

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