Qualification of encapsulation materials for module-level-processing

Steckenreiter, Verena; Horbelt, Renate; Wright, Daniel Nilsen; Nese, Martin; Brendel, Rolf

doi:10.1016/j.solmat.2013.06.012

Cited by 17 publications

(12 citation statements)

References 15 publications

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“…The wafers are manually bonded on the glass and the wafer/silicone/glass stack is cured at a temperature of 200 • C for 1 h in a vacuum. This additional curing is performed to avoid silicone contamination of the plasma chamber during PECVD deposition [9], [21]. The samples are then left in the vacuum overnight in order to remove air bubbles that are created during the manual bonding.…”

Section: Device Processmentioning

confidence: 99%

Heterojunction Interdigitated Back-Contact Solar Cells Fabricated on Wafer Bonded to Glass

Granata¹,

Aleman²,

Bearda³

et al. 2014

IEEE J. Photovoltaics

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Future wafer-based silicon solar cells will be fabricated on thin (<140 μm) wafers. However, technologies to handle thin wafers during cell processing are not yet available for industry. In this paper, a flow to handle thin wafers during rear side cell processing is developed and demonstrated on 4-in 200 μm-thick wafers. The flow involves bonding the wafers to glass after frontside processing followed by a low-temperature p-n heterojunction formation on the rear side. 2.5 × 2.5 cm 2 amorphous/crystalline silicon heterojunction interdigitated back-contact solar cells are fabricated by use of lithography while bonded to glass, and they show an efficiency of up to 17.7%. Shunts, infrared light absorption, and rear side interface passivation are identified as the main efficiency losses. Dedicated experiments suggest that the passivation losses are related to the degradation of the adhesive during wafer cleaning. Hence, methods to improve the compatibility of the adhesive with the cleaning process are discussed. Index Terms-Heterojunction silicon solar cells, interdigitatedback-contact (i-BC), superstrate processing.

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Section: Device Processmentioning

confidence: 99%

Heterojunction Interdigitated Back-Contact Solar Cells Fabricated on Wafer Bonded to Glass

Granata¹,

Aleman²,

Bearda³

et al. 2014

IEEE J. Photovoltaics

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“…The residual porous silicon belonging to the annealed LP-TL must be removed using a silicon etchant that does not react strongly with the silicone. Moreover, silicone should not be directly exposed to the plasma during amorphous silicon deposition, because it will lead to very poor surface passivation [15][16][17]. In order to minimize the problems associated with silicone, a shielded configuration (i.e.…”

Section: Experimental Methodsmentioning

confidence: 99%

Kerfless layer-transfer of thin epitaxial silicon foils using novel multiple layer porous silicon stacks with near 100% detachment yield and large minority carrier diffusion lengths

Radhakrishnan

Martini

Depauw

et al. 2015

Solar Energy Materials and Solar Cells

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“…Both components are more robust to the front side processing steps that are carried out after bonding the bilayer to the rear substrate than a plastic backsheet and other encapsulation materials like ethylene-vinyl acetate (EVA). 50 We estimate the costs of the silicone encapsulant to be 20 $/kg, which results in layer costs per area of 27% compared to an EVA layer. The front side is encapsulated with a single EVA sheet and high-quality glass with anti-reflective coating.…”

Section: Cost Estimationmentioning

confidence: 99%

Kerfless exfoliated thin crystalline Si wafers with Al metallization layers for solar cells

et al. 2015

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We report on a kerfless exfoliation approach to further reduce the costs of crystalline silicon photovoltaics making use of evaporated Al as a double functional layer. The Al serves as the stress inducing element to drive the exfoliation process and can be maintained as a rear contacting layer in the solar cell after exfoliation. The 50-70 lm thick exfoliated Si layers show effective minority carrier lifetimes around 180 ls with diffusion lengths of 10 times the layer thickness. We analyze the thermo-mechanical properties of the Al layer by x-ray diffraction analysis and investigate its influence on the exfoliation process. We evaluate the approach for the implementation into solar cell production by determining processing limits and estimating cost advantages of a possible solar cell design route. The Al-Si bilayers are mechanically stable under processing conditions and exhibit a moderate cost savings potential of 3-36% compared to other c-Si cell concepts.

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Qualification of encapsulation materials for module-level-processing

Cited by 17 publications

References 15 publications

Heterojunction Interdigitated Back-Contact Solar Cells Fabricated on Wafer Bonded to Glass

Heterojunction Interdigitated Back-Contact Solar Cells Fabricated on Wafer Bonded to Glass

Kerfless layer-transfer of thin epitaxial silicon foils using novel multiple layer porous silicon stacks with near 100% detachment yield and large minority carrier diffusion lengths

Kerfless exfoliated thin crystalline Si wafers with Al metallization layers for solar cells

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