Q

Yang, Xiaoxia; Chen, Anmin; Ma, Yingfu; Gao, Yuan; Gao, Zhemin; Fu, Bingyi; Sun, Fuchun; Qiao, Jie; Li, Quan; Wan, Shuqian; Werner, Hermut; Chuang, Yinfu; Zhu, Xiulin

doi:10.1007/978-3-662-05177-1_17

Cited by 1 publication

(3 citation statements)

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“…The principle of PDV measurement is based on the Doppler frequency shift effect. The detailed description of the measurement can be found elsewhere 10 . The explosion current and voltage of the exploding foil were measured by a homemade device, whose schematic diagram is shown in Figure 3.…”

Section: Methodsmentioning

confidence: 99%

“…The detailed description of the measurement can be found elsewhere. 10 The explosion current and voltage of the exploding foil were measured by a homemade device, whose schematic diagram is shown in Figure 3. The device consisted of the high-voltage pulse power source, the EFI device (with a nickel barrel), and the signal acquisition system.…”

Section: Velocity Measurementmentioning

confidence: 99%

“…A reliable flyer material needs to be robust, able to withstand an impulsive launch, and remain intact at speed approaching supersonic velocity. Various materials such as silicon, 3 polymethyl methacrylate (PMMA), 7 Mylar, 8 SU-8, 9 polyimide (PI), [10][11][12] parylene C (PC), 13 and PC/metal alloy 14,15 have been used for the preparation of FFI flyer. Compared with other materials, PI is a more commonly used flyer material that has several distinct advantages such as favorable dielectric properties and high thermal stability.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Optimizing cure temperature of polyimide flyer for exploding foil initiator applications

Sun

Zhan

et al. 2022

J of Applied Polymer Sci

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Polyimide (PI) is an ideal flyer material commonly used for exploding foil initiator (EFI) systems. The material properties of PI influence the flight ability of the flyer. Curing temperature during the preparation process of PI is one of the key factors influencing the material properties. In this study, we investigated the effect of the PI film curing temperature on the material properties and the flight ability by characterizing IR transmittance, XPS, and nano-hardness. The results show that the flight ability of the flyer is highly dependent on the curing temperature. Curing at 250 C is beneficial for the flyer to have an optimal flight velocity, which was attributed to the good chemical and mechanical behavior of the material. Increase in curing temperature would weaken the material properties to some extent.High-temperature cure (e.g., 400 C), would break the molecular chain and carbonize the material, causing significant drop in flight velocity of the flyer. The study is expected to contribute to the development of high-performance flyer for EFI applications.

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Section: Methodsmentioning

confidence: 99%

Section: Velocity Measurementmentioning

confidence: 99%