Pushing the Limits of Air Cooling with Novel Two-Phase Prototypes for High Power Microprocessors

Ghaffari, Omidreza; Vincent, Manuel; Grenier, Francis; Larimi, Yaser Nabavi; Jasmin, Simon; Fréchette, Luc; Sylvestre, Julien

doi:10.1109/itherm55368.2023.10177612

Cited by 6 publications

(1 citation statement)

References 25 publications

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“…MuSEP coating [ 36 , 37 , 38 , 39 , 40 , 41 ] is a multi-scale porous electroplated coating which is capable of increasing the pool boiling efficiency in the cases where the coating is configured as the heat transport surface for the immersion cooling of a data processor. Some of its beneficial features are the increased HTC, the promotion of boiling incipience, and the delaying of CHF.…”

Section: Surface Modificationmentioning

confidence: 99%

An Overview of Innovative Surface-Modification Routes for Pool Boiling Enhancement

Pereira,

Souza,

Moreira

et al. 2024

Micromachines

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This overview intends to provide a comprehensive assessment of the novel fluids and the current techniques for surface modification for pool boiling enhancement. The surface modification at macro-, micro-, and nanoscales is assessed concerning the underlying fluid routing and capability to eliminate the incipient boiling hysteresis and ameliorate the pool boiling heat-transfer ability, particularly when employed together with self-rewetting fluids and nanofluids with enriched thermophysical properties. Considering the nanofluids, it is viable to take the profit of their high thermal conductivity and their specific heat simultaneously and to produce a film of deposited nanoparticles onto the heating surface, which possesses enhanced surface roughness and an increased density of nucleation sites. Whilst the diverse improvement scales are found to achieve distinct levels of success regarding the nucleate boiling heat-transfer capability enhancement, it is also shown that the micro–nanoscale boiling surface features are susceptible to blockage, leading to the degradation of the improvement with time. Furthermore, topics relating to the heat transfer thermal behavior, ease of manufacture, cost-effectiveness, reliability, and durability are reviewed whenever available and challenges and recommendations for further research are highlighted.

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