Pulsed laser-enabled liquid-solid transfer for scalable printing of two-dimensional metal oxide thin film

An, Licong; Branco, Danilo de Camargo; Liu, Xingtao; Jiang, Haoqing; Wang, Mingyi; Xu, Jin; Zhang, Ruifang; Wu, Wenzhuo; Cheng, Gary J.

doi:10.1016/j.matt.2023.01.021

Cited by 5 publications

(4 citation statements)

References 45 publications

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“…[ 137 ] Recently, An et al proposed a laser‐energy modulated transfer printing technique for the construction of 2D metal oxide film patterns, which utilized the liquid‐to‐solid oxidation reaction of self‐limiting oxide skin encapsulated EGaIn nanoparticles (Figure 10C). [ 54 ] EGaIn nanoparticles were spray coated onto the SiO 2 /Si wafer substrate and confined by a sapphire receiver substrate. Laser‐energy injection beyond the critical value causes the entire rupture of the oxide film on EGaIn nanoparticles and the explosive fusion of adjacent particles to form sintered liquid metal.…”

Section: Strategies For Regulating Stamp/ink Interfacial Strength In ...mentioning

confidence: 99%

Section: Strategies For Regulating Stamp/ink Interfacial Strength In ...mentioning

confidence: 99%

“…Current strategies for designing switchable adhesive stamps include selecting materials with intrinsic adhesive conversion ability for stamp fabrication, [12,31,[73][74][75][76][77][78][79][80][81] decorating the stamp surface with responsive materials, [82][83][84][85] and mimicking the microstructure of natural creature adhesive organs. [41,43,[86][87][88] Besides endowing the stamp with adhesion conversion ability, another regulation strategy is to utilize the solid-liquid transition occurring on the stamp or ink to remove a certain phase at the interface, [44,54,89,90] which results in a sharp decline in the interfacial strength. The above regulation strategies will be systematically discussed in this section.…”

Section: Strategies For Regulating Stamp/ink Interfacial Strength In ...mentioning

confidence: 99%

“…A basic transfer printing system includes ink, donor substrate, stamp, and receiver substrate. Among these elements, the ink encompasses a variety of functional materials or integrated devices toward different application scenarios, which can be categorized as metals (nanoparticles, [ 51 ] nanowires, [ 52 ] and liquid metals [ 53 ] ), inorganic materials (metal oxide semiconductors, [ 54 ] III–V compound semiconductors, [ 55 ] silicon, [ 56 ] and QDs [ 20 ] ), organic materials (conducting polymers [ 57 ] ), carbon‐based materials (CNTs [ 11 ] and graphene [ 58 ] ), integrated units (micro‐LED pixels, [ 59 ] sensor arrays, [ 60 ] and photovoltaic cells [ 61 ] ). The ink is prepared on the donor substrate and latter patterned through various micro–nano processing methods.…”

Section: Fundamental Features Of Transfer Printing Systemsmentioning

confidence: 99%

See 3 more Smart Citations

Regulatable interfacial adhesion between stamp and ink for transfer printing

Li,

Zhang,

Wang

2024

Interdisciplinary Materials

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As an emerging processing technology, transfer printing enables the assembly of functional material arrays (called inks) on various substrates with micro/nanoscale resolution and has been widely used in the fabrication of flexible electronics and display systems. The critical steps in transfer printing are the ink pick‐up and printing processes governed by the switching of adhesion states at the stamp/ink interface. In this review, we first introduce the history of transfer printing in terms of the transfer methods, transferred materials, and applications. Then, the fundamental characteristics of the transfer printing system and typical strategies for regulating the stamp/ink interfacial adhesion strength are summarized and exemplified. Finally, future challenges and opportunities for developing the novel stamps, inks, and substrates with intelligent adhesion capability are discussed, aiming to inspire the innovation in the design of transfer printing systems.

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Section: Strategies For Regulating Stamp/ink Interfacial Strength In ...mentioning

confidence: 99%

Section: Strategies For Regulating Stamp/ink Interfacial Strength In ...mentioning

confidence: 99%

Section: Strategies For Regulating Stamp/ink Interfacial Strength In ...mentioning

confidence: 99%

Section: Fundamental Features Of Transfer Printing Systemsmentioning

confidence: 99%

See 2 more Smart Citations

Regulatable interfacial adhesion between stamp and ink for transfer printing

Li,

Zhang,

Wang

2024

Interdisciplinary Materials

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Advances in Liquid Metal Printed 2D Oxide Electronics

Scheideler,

Nomura

2024

Adv Funct Materials

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Abstract2D metal oxides (2DMOs) have recently emerged as a high‐performance class of ultrathin, wide bandgap materials offering exceptional electrical and optical properties for a wide area of device applications in energy, sensing, and display technologies. Liquid metal printing represents a thermodynamically advantageous strategy for synthesizing 2DMOs by a solvent‐free and vacuum‐free scalable method. Here, recent progress in the field of liquid metal printed 2D oxides is reviewed, considering how the physics of Cabrera‐Mott oxidation gives this rapid, low‐temperature process advantages over alternatives such as sol‐gel and nanoparticle processing. The growth, composition, and crystallinity of a burgeoning set of 1–3 nm thick liquid metal printed semiconducting, conducting, and dielectric oxides are analyzed that are uniquely suited for the fabrication of high‐performance flexible electronics. The advantages and limitations of these strategies are considered, highlighting opportunities to amplify the impact of 2DMO through large‐area printing, the design of doped metal alloys, stacking of 2DMO to electrostatically engineer new oxide heterostructures, and implementation of 2D oxide devices for gas sensing, photodetection, and neuromorphic computing.

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Van der Waals Encapsulation by Ultrathin Oxide for Air‐Sensitive 2D Materials

Yi,

Wu,

et al. 2024

Advanced Materials

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The ambient stability is one of the focal points for applications of 2D materials, especially for those well‐known air‐sensitive ones, such as black phosphorus (BP) and transitional metal telluride. Traditional methods of encapsulation, such as atomic layer deposition of oxides and heterogeneous integration of hexagonal boron nitride, can hardly avoid removal of encapsulation layer when the 2D materials are encapsulated for further device fabrication, which causes complexity and damage during the procedure. Here, a van der Waals encapsulation method that allows direct device fabrication without removal of encapsulation layer is introduced using Ga2O3 from liquid gallium. Taking advantage of the robust isolation ability against ambient environment of the dense native oxide of gallium, hundreds of times longer retention time of (opto)electronic properties of encapsulated BP and MoTe2 devices is realized than unencapsulated devices. Due to the ultrathin high‐κ properties of Ga2O3, top‐gated devices are directly fabricated with the encapsulation layer, simultaneously as a dielectric layer. This direct device fabrication is realized by selective etching of Ga2O3, leaving the encapsulated materials intact. Encapsulated 1T' MoTe2 exhibits high conductivity even after 150 days in ambient environment. This method is, therefore, highlighted as a promising and distinctive one compared with traditional passivation approaches.

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Pulsed laser-enabled liquid-solid transfer for scalable printing of two-dimensional metal oxide thin film

Cited by 5 publications

References 45 publications

Regulatable interfacial adhesion between stamp and ink for transfer printing

Regulatable interfacial adhesion between stamp and ink for transfer printing

Advances in Liquid Metal Printed 2D Oxide Electronics

Van der Waals Encapsulation by Ultrathin Oxide for Air‐Sensitive 2D Materials

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