2015
DOI: 10.1016/j.jcrysgro.2015.03.055
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Pulsed growth techniques in plasma-assisted molecular beam epitaxy of Al Ga1−N layers with medium Al content (x=0.4–0.6)

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Cited by 15 publications
(5 citation statements)
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“…The formation of the metal microdroplets under these conditions was avoided by using Ga (or Al) flux interruptions with duration controlled by pyrometry. 18,19) The nucleation and growth were also monitored in situ by reflection high-energy electron diffraction technique (RHEED).…”
Section: Experimental Methodsmentioning
confidence: 99%
“…The formation of the metal microdroplets under these conditions was avoided by using Ga (or Al) flux interruptions with duration controlled by pyrometry. 18,19) The nucleation and growth were also monitored in situ by reflection high-energy electron diffraction technique (RHEED).…”
Section: Experimental Methodsmentioning
confidence: 99%
“…Moreover, the MBE growth takes place at lower substrate temperatures compared with other growth techniques for the same material. For example, the substrate temperature for growing AlGaN thin films by MBE is generally below 800 C, [88][89][90][91][92] whereas by MOCVD it requires 1000-1200 C. [24,34,[93][94][95] Lastly, the MBE growth chamber is equipped with RHEED, which allows an in situ monitoring of the growth and an instantaneous adjustment on the growth parameters, beneficial to the growth of ultrathin layers, e.g., the monolayer (ML)-thick GaN QWs. [96][97][98] In the next two subsections, we will show that benefited from these merits, high-quality AlGaN alloys including both thin films and nanowires can be grown by MBE, which provides a promising path to the electrically injected AlGaN DUV lasers by MBE.…”
Section: A Brief History and Main Features Of Mbementioning
confidence: 99%
“…3(a). After the nucleation layer, a 740-nmthick AlN layer was grown in metal-modulated epitaxy (MME) mode 31) followed by a 320-nm-thick AlN layer grown under continuous slightly metal-rich conditions at the same temperature. During growth of the MME layer the N 2 plasma flow was kept constant whereas the Al flow was periodically switched off (2 min turn-on period, 0.5 min turn-off period) to prevent formation of Al droplets.…”
Section: Plasma-assisted Mbe Growth Of the Aln Layermentioning
confidence: 99%