Pulse electric current induced interfacial ductile phase on improving the mechanical properties of the Au20Sn/Cu solder joints

Liu, Chuanlei; Wang, Meng; Peng, Hailong; Peng, Jian; Liu, Huashan

doi:10.1007/s10854-024-13002-8

J Mater Sci: Mater Electron

2024

DOI: 10.1007/s10854-024-13002-8

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Pulse electric current induced interfacial ductile phase on improving the mechanical properties of the Au20Sn/Cu solder joints

Chuanlei Liu,

Meng Wang,

Hailong Peng

et al.

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Pulse electric current induced interfacial ductile phase on improving the mechanical properties of the Au20Sn/Cu solder joints

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References 62 publications

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