Pulse and pulse reverse plating of copper from acid sulphate solutions

Leisner, Peter; Fredenberg, Mikael; Belov, Ilja

doi:10.1179/002029610x12791981507721

Cited by 10 publications

(9 citation statements)

References 23 publications

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“…Radiation loss is also low due to close contact between the flexible ceiling and cavity. To minimize conductor loss, the IM technology implementation aimed at a high surface finish for the part, which was maintained during metalization by utilizing a Reverse Power Plating (RPP) method (R a = 0.31 µm) [23].…”

Section: Resonator and Filter Rf Designmentioning

confidence: 99%

“…Next, the samples are inserted in a magnetron sputtering equipment to deposit a total of 0.5 microns seed layer of Ti/Au (20 nm of Ti) to electroplate a thick copper. Samples are inserted in a copper sulfate bath, and an RPP method is used to obtain a high density and fine surface finish [23]. The LCP membrane used as a tuning element is 25 microns thick metalized with a copper layer of 9 microns.…”

Section: Fabrication and Measurements A Resonatormentioning

confidence: 99%

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High-Q High Power Tunable Filters Manufactured With Injection Molding Technology

et al. 2022

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This paper presents the first demonstration of injection molding technology to enable large-scale mass manufacturing of high-performance tunable microwave filters to meet the growing needs of 5G small cell stations. This is the first time that a tunable filter satisfies all four of the following requirements simultaneously: low manufacturing cost, high quality factor, wide tuning range, and high power handling. Exhaustive research exists on the use of polymers for 3D microwave device manufacturing; nonetheless, mass-production technologies, such as injection molding, can provide low costs without compromising performance. The proposed bandpass filter implementation uses a tunable evanescent-mode cavity resonator injection molded with acrylonitrile-butadiene-styrene thermoplastic polymer. In addition, changing the critical gap size over the resonator's post through a commercial micro-actuator provides frequency tuning. The measured filter achieves an 86% tuning range from 2.8 -5.2 GHz with a state-of-the-art measured unloaded quality factor Q u of 1548 -2573. The filter has a measured insertion loss of 0.06 -0.1 dB with a fractional bandwidth from 7.6 -8.4 % across the entire tuning range. Moreover, for the first time in this manufacturing technology implementation, a bandpass filter is demonstrated with power handling capabilities beyond 100 W. The manufactured device demonstrates the significant potential of this technology for the scale-up manufacturing of reconfigurable high-Q RF filters without compromising performance.INDEX TERMS Evanescent-mode cavity filter, quality factor (Q), reconfigurable filter, tunable filter, injection molding, scale-up manufacturing method.

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Section: Resonator and Filter Rf Designmentioning

confidence: 99%

Section: Fabrication and Measurements A Resonatormentioning

confidence: 99%

High-Q High Power Tunable Filters Manufactured With Injection Molding Technology

et al. 2022

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“…The period pulse reverse (PPR) plating [13,14], in which cathodic pulses are followed by anodic pulses, is a promising technology to achieve uniform copper deposition in high aspect ratio holes [15][16][17][18]. The periodically reverse current could dissolve the overdeposited copper in the current crowding position (PTH entry or exit).…”

Section: Introductionmentioning

confidence: 99%

Ultra-Uniform Copper Deposition in High Aspect Ratio Plated through Holes via Pulse-Reverse Plating

Li³

et al. 2022

Coatings

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The uniformity and microstructure of the copper deposition in the high aspect ratio plated through holes (penetrating holes) are crucial for the performance of printed circuit board. We systematically investigated the effects of reverse pulse parameters in the period pulse reverse (PPR) plating on the uniformity and microstructure of the copper deposition, including reverse pulse frequency, reverse pulse duty cycle and reverse pulse current density. The Cu deposition behavior (throwing power) and its crystallographic characteristics, including grain size, crystallographic orientation, and grain boundary, were characterized by means of field-emission scanning electron microscopy (FE-SEM), X-ray diffractometer (XRD), and electron backscatter diffraction (EBSD). Our results clarify that the reverse pulse current density and duty ratio should be low to achieve the full filling and high uniformity of the through holes. The reverse pulse frequency of 1500 Hz would prevent the through holes to be fully filled. The copper electrodeposition in PTH prepared by double pulse electrodeposition has the good (111) surface texture and grain boundary distribution. This work demonstrated that the period pulse reverse (PPR) plating provides unique advantages in achieving the ultra-uniform copper deposition in the high aspect ratio plated through holes.

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“…Thus, to obtain uniform electrodeposition, optimizing the plating bath configuration is fundamental to a successful electrodeposition. Currently, some attempts have been taken to improve the uniformity of copper electrodeposition, such as using eductor for solution agitation, auxiliary anodes and so on (Qiao et al , 2014; Leisner et al , 2010). However, because of the large number of impact factors in electrodeposition, experimentally determining all parameters and electrodeposition conditions for an optimized plating bath become unmanageable.…”

Section: Introductionmentioning

confidence: 99%

Multi-physics coupling aid uniformity improvement in pattern plating

Wang

et al. 2016

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Purpose The uniformity of electrodeposition is the key to successful application of pattern plating because the quality of electrodeposited copper layer has a huge impact on the performance of printed circuit boards (PCBs). The multi-physics coupling technology was used to accurately analyze and forecast the characteristics of electrochemical system. Further, an optimized plating bath was used to achieve a uniform electrodeposition. Design/methodology/approach A multi-physics coupling numerical simulation based on the finite element method was used to optimize electrodeposition conditions in pattern plating process. The influences of geometric and electrochemical factors on uniformity of current distribution and electrodeposited layer thickness were discussed by multi-physics coupling. Findings The model results showed that the distance between cathode and anode and the insulating shield had a great impact on uniformity of electrodeposition. By numerical simulation, it had been proved that using an auxiliary cathode was an effective and simple way to improve uniformity of electrodeposition due to redistributing of the current. This helped to achieve more uniform surface of the copper patterns by preventing the edge effect and the roughness of the copper layer was reduced to 1 per cent in the secondary current distribution model. Research limitations/implications The research is still in progress with the development of high-performance computers. Practical implications A multi-physics coupling platform is an excellent tool for quickly and cheaply studying the process behaviors under a variety of operating conditions. Social implications The numerical simulation method has laid the foundation for the design and improvement of the plating bath. Originality/value By multi-physics coupling technology, we built a bridge between theoretical and experimental study for control of uniformity of pattern plating in PCB manufacturing. This method can help optimize the design of plating bath and uniformity of pattern plating in PCB manufacturing.

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Pulse and pulse reverse plating of copper from acid sulphate solutions

Cited by 10 publications

References 23 publications

High-Q High Power Tunable Filters Manufactured With Injection Molding Technology

High-Q High Power Tunable Filters Manufactured With Injection Molding Technology

Ultra-Uniform Copper Deposition in High Aspect Ratio Plated through Holes via Pulse-Reverse Plating

Multi-physics coupling aid uniformity improvement in pattern plating

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