Prototyping of low-cost wafer level packages

Chen, Haoyang; Tee, Tong Yan; Siew, Glen; Soh, Serine; Kang, In Soo; Kim, Jong Heon; Lee, Teck Kheng; Ser, Bok Leng; Ng, Hun Shen; Hoe, Germaine; Gao, Shan

doi:10.1109/eptc.2011.6184496

2011 IEEE 13th Electronics Packaging Technology Conference 2011

DOI: 10.1109/eptc.2011.6184496

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Prototyping of low-cost wafer level packages

Haoyang Chen¹,

Tong Yan Tee²,

Glen Siew³

et al.

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Prototyping of low-cost wafer level packages

Cited by 3 publications

References 9 publications

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