Proceedings of the 28th International Workshop on Vertex Detectors — PoS(Vertex2019) 2020
DOI: 10.22323/1.373.0058
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Prototype Module Construction for the High Luminosity Upgrade of the CMS Pixel Detector

Abstract: With the planned upgrades of the LHC towards high luminosity operation, the entire CMS silicon tracker will be replaced in order to cope with the resulting elevated pileup and radiation levels. To fulfill these requirements for the CMS pixel detector, a new readout chip was developed by the RD53 collaboration in 65 nm CMOS technology, featuring a higher readout bandwidth along with increased granularity and radiation tolerance. These chips are operated at high currents rendering the classical parallel powering… Show more

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Cited by 6 publications
(7 citation statements)
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“…Given the importance of the serial powering scheme in the future detector, several studies have been carried out with CROCv1 chips in different conditions, both by using single-chip boards and with prototype detector modules [17,18]. Important data have also been obtained from wafer tests.…”
Section: Serial Powering Testsmentioning
confidence: 99%
“…Given the importance of the serial powering scheme in the future detector, several studies have been carried out with CROCv1 chips in different conditions, both by using single-chip boards and with prototype detector modules [17,18]. Important data have also been obtained from wafer tests.…”
Section: Serial Powering Testsmentioning
confidence: 99%
“…2, while Fig. 3 shows the noise distribution of a module in standalone operation and the chip by chip difference after inclusion in the serial chain [8].…”
Section: Inner Tracker Systemmentioning
confidence: 99%
“…Typical ENC distribution in electrons of an individually powered readout chip, e.g. RD53A, (left) and per-pixel difference after inclusion in a serially powered chain (right)[8].…”
mentioning
confidence: 99%
“…Fig. 3 shows the design of the HDI for the double-chip (left) and quad-chip modules (right) [4]. The chips of a module are bump-bonded to the silicon sensor (shown in turquoise) which will be glued to the HDI (shown in green).…”
Section: Pixel Module Componentsmentioning
confidence: 99%