Propargyl resin derived from biosynthesized oligophenols for the application of high temperature composite matrix

Abstract

A novel addition‐cure‐type propargyloligophenol resin for high‐temperature usage was prepared via a two‐step process: Horseradish Peroxidase (HRP) catalyzed oxidation polymerization of phenols to oligophenols, and Williamson etherification of oligophenols to propargyloligophenols. Propargyloligophenols possess an ideal processability for composite manufacture, i.e. good solubility, low melting point (< 50 °C), and thermal curability. As shown by Differential Scanning Calorimetry (DSC), propargyloligophenol resin upon heating experiences a broad thermal exothermic peak in the range of 175–300 °C peaking at around 260 °C. The cured resin is high‐temperature resistant with an initial decomposition temperature > 400 °C and an anaerobic char yield > 60 % at 700 °C. The mechanical properties of glass fabric‐reinforced propargyloligophenol laminate were superior to those of conventional phenolic resins. The results showed that propargyloligophenol resin is a prospective polymeric matrix for high temperature composites.

Oligosilylarylnitrile: The Thermoresistant Thermosetting Resin with High Comprehensive Properties

“…Polyimides and polyimide composites have been applied in aerospace and electronics industries because of their excellent high-temperature mechanical performance, adhesive property, moisture retardance, and oxidation endurance. , Phthalonitrile is another star member of the high-temperature engineering thermoset, which was started by Keller; by now, it has evolved to act as an attractive high thermal thermoset with superior mechanical performance, low water absorption, and exceptional flame retardancy. , Polysilylarylacetylene is one kind of high-temperature nonpolar resin, which has enhanced heat resistance, excellent mechanical properties, dielectric properties, and high-temperature ceramic performances. The cured polysilylarylacetylene can be used as high-temperature resistant materials, wave-transmitting materials, semiconductor materials, ceramic precursors, and so forth. , Another group of acetylene-containing polymers has been reported that phenolic compounds such as Novolac or polyphenols were successfully modified with ethynyl groups for the preparation of high-performance addition-curable resins …”

“…11,12 Another group of acetylene-containing polymers has been reported that phenolic compounds such as Novolac or polyphenols were successfully modified with ethynyl groups for the preparation of highperformance addition-curable resins. 13 However, it is still an extreme challenge to prepare a hightemperature thermoset with ideal comprehensive properties of broad processing window, moderate cure condition, high thermal resistance, and high mechanical property. 14 For example, for polyimide and phthalonitrile resins, they have admirable high-temperature mechanical property but their processability is really poor (high melting point, extremely high curing temperature, and narrow processing window); however, for polysilylarylacetylene resin, it has excellent processability (liquid resin, moderate curing temperature, and appropriate processing window) and thermal resistance, but its mechanical property is limited (weak interfacial adhesion of fiber and matrix).…”