TiO2 has various inherent advantages in practical devices: chemical stability, non‐toxicity, and abundance on earth, as highlighted in a range of applications of TiO2 surfaces in photocatalysis/optoelectronics. However, the application of TiO2 to three‐terminal devices has been limited; for example, TiO2‐channel transistors, which may potentially modulate the TiO2 surface properties by electrostatic back gating, has suffered from low field‐effect mobility (μFE < 1 cm2 V−1 s−1) irrespective of fabrication methods. The major challenge is to control phases (rutile/anatase) and defects (oxygen vacancy) simultaneously in TiO2 thin films. Here, we achieved μFE ∼ 10 cm2 V−1 s−1 in TiO2‐channel transistors, one order higher than before and even comparable to InGaZnO channels. The major improvement is the independent control of phases and defects in TiO2 thin films; we formed short‐range order of anatase phase in the amorphous deposition, and minimized the number of defects in the subsequent thermal treatment. Besides, we showed this independent control of phases and defects are underpinned by excellent thermal stability of TiO2/SiO2 interfaces. These results demonstrate TiO2 can be a transistor channel with a reasonable μFE and ON/OFF ratio (>6 orders), not only changing the conventional image of this material, but also promising new functionalities based on unique properties of TiO2.