2010
DOI: 10.1109/temc.2010.2048755
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Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

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Cited by 166 publications
(22 citation statements)
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“…Last, more research is needed to study the simultaneous decoupling of multiple components in close proximity using SVAMs. This will find applications in signal integrity [88][89][90], EMC [91,92], multiple-input and multiple-output antennas [93][94][95], phased array antennas [96] and more.…”
Section: Discussionmentioning
confidence: 99%
“…Last, more research is needed to study the simultaneous decoupling of multiple components in close proximity using SVAMs. This will find applications in signal integrity [88][89][90], EMC [91,92], multiple-input and multiple-output antennas [93][94][95], phased array antennas [96] and more.…”
Section: Discussionmentioning
confidence: 99%
“…Thirdly, compared with other printing technologies, ink-jet printing is more accurate and has more advantages in realizing patterned preparation and full-color display. 209–212…”
Section: Printing Display Technologymentioning
confidence: 99%
“…with |·| denoting the absolute value of the complex coefficient 1 . The procedure can be rewritten in an iterative form for obtaining the eigevector v 1…”
Section: Power Iterationmentioning
confidence: 99%
“…Electromagnetic compatibility (EMC), electromagnetic interference (EMI), and signal integrity are critical for design and operation of high-performance communication and computing systems. 1,2 Because of the high integration and complexity of components and systems, EMC and immunity to noise has to be assessed in an accurate and efficient way already in the modeling stage to limit cost and time to market for product development.…”
Section: Introductionmentioning
confidence: 99%
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