2024
DOI: 10.1039/d4ra01408a
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Progress of research on the bonding-strength improvement of two-layer adhesive-free flexible copper-clad laminates

Wanqi Tang,
Yuxi Liu,
Xianghai Jing
et al.

Abstract: Bond strength of two-layer adhesive-free flexible copper-clad laminate is an important factor that directly affects the stability and reliability of electronic devices.

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