Abstract:Rapid progress has been made in recent years repurposing CMOS fabrication tools to build complex photonic circuits. As the field of silicon photonics becomes more mature, foundry processes will be an essential piece of the ecosystem for eliminating process risk and allowing the community to focus on adding value through clever design. Multi-project wafer runs are a useful tool to promote further development by providing inexpensive, low-risk prototyping opportunities to academic and commercial researchers. Com… Show more
“…One of the key mechanisms behind the economic success of silicon electronics is the open-access model, where fabless companies can have chips fabricated in commercial foundries that provide standardized fabrication platforms. This separation of design and product development on one hand, and fabrication on the other hand, has acted as a multiplier in economic activity, with hundreds of thriving fabless companies for every foundry [34], [142], [143]. It is a win-win formula, lowering the investment for fabless companies and generating profitable volumes for the foundries.…”
Section: A Access Modelsmentioning
confidence: 99%
“…For the proof-of-concept and early stage R&D, MPW shuttle runs are ideally suited. MPWs play an instrumental role in catalyzing the field of silicon photonics by providing lowcost access to start-ups, small/medium enterprises (SME), and low-CAP companies to test their design ideas using a standard process flow of different fabs offering open-access technologies [33], [34], [143]. MPW helps the designers to gauge the capabilities available in a technology.…”
Silicon Photonics is widely acknowledged as a gamechanging technology, driven by the needs of datacom and telecom. Silicon Photonics builds on highly capital-intensive manufacturing infrastructure, and mature open-access silicon photonics platforms are translating the technology from research fabs to industrial manufacturing levels. To meet the current market demands for silicon photonics manufacturing, a variety of openaccess platforms is offered by CMOS pilot lines, R&D institutes and commercial foundries. This paper presents an overview of existing and upcoming commercial and non-commercial openaccess silicon photonics technology platforms. We also discuss the diversity in these open-access platforms and their key differentiators.
“…One of the key mechanisms behind the economic success of silicon electronics is the open-access model, where fabless companies can have chips fabricated in commercial foundries that provide standardized fabrication platforms. This separation of design and product development on one hand, and fabrication on the other hand, has acted as a multiplier in economic activity, with hundreds of thriving fabless companies for every foundry [34], [142], [143]. It is a win-win formula, lowering the investment for fabless companies and generating profitable volumes for the foundries.…”
Section: A Access Modelsmentioning
confidence: 99%
“…For the proof-of-concept and early stage R&D, MPW shuttle runs are ideally suited. MPWs play an instrumental role in catalyzing the field of silicon photonics by providing lowcost access to start-ups, small/medium enterprises (SME), and low-CAP companies to test their design ideas using a standard process flow of different fabs offering open-access technologies [33], [34], [143]. MPW helps the designers to gauge the capabilities available in a technology.…”
Silicon Photonics is widely acknowledged as a gamechanging technology, driven by the needs of datacom and telecom. Silicon Photonics builds on highly capital-intensive manufacturing infrastructure, and mature open-access silicon photonics platforms are translating the technology from research fabs to industrial manufacturing levels. To meet the current market demands for silicon photonics manufacturing, a variety of openaccess platforms is offered by CMOS pilot lines, R&D institutes and commercial foundries. This paper presents an overview of existing and upcoming commercial and non-commercial openaccess silicon photonics technology platforms. We also discuss the diversity in these open-access platforms and their key differentiators.
“…Silicon-on-insulator (SOI) is amongst the mainstream photonic integration platforms regarded as the most promising candidate for ultra-compact photonic integrated circuits, due to the high refractive index contrast between the silicon waveguide core and the SiO2 cladding. More importantly, the compatibility with the well-established CMOS fabrication technology, both in terms of the used materials and processing techniques, enables a low-cost and high-volume production of photonic integrated circuits (PICs) with high yield [1][2][3][4]. Driven by the telecom and datacom industry significant progress has been made in the field of silicon photonics in the past decade.…”
Section: Introductionmentioning
confidence: 99%
“…Driven by the telecom and datacom industry significant progress has been made in the field of silicon photonics in the past decade. A variety of high-performance passive building blocks and high-bandwidth Si and GeSi active devices (modulators and photodetectors) have been developed making use of a strong light-matter interaction, resulting from the high confinement of the optical field in the waveguide, thereby paving the way for scalable manufacturing of complex high-speed PICs [5]. Moreover, with a wide transparency window ranging from 1.2 to 4 m, silicon photonics is emerging as a potential platform to realize miniaturized sensors [6][7][8][9].…”
An electrically pumped DFB laser integrated on and coupled to a silicon waveguide circuit is demonstrated by transfer printing a 40 × 970 μm III-V coupon, defined on a III-V epitaxial wafer. A second-order grating defined in the silicon device layer with a period of 477 nm and a duty cycle of 75% was used for realizing single mode emission, while an adiabatic taper structure is used for coupling to the silicon waveguide layer. 18 mA threshold current and a maximum single-sided waveguide-coupled output power above 2 mW is obtained at 20°C. Single mode operation around 1550 nm with > 40 dB side mode suppression ratio (SMSR) is realized. This new integration approach allows for the very efficient use of the III-V material and the massively parallel integration of these coupons on a silicon photonic integrated circuit wafer. It also allows for the intimate integration of III-V opto-electronic components based on different epitaxial layer structures.
“…Silicon photonics has proven to be an excellent platform for photonic integration as silicon has a high refractive index (n ∼ 3.4) and low optical losses at telecom wavelengths, while its nanofabrication is compatible with CMOS industry standards, allowing for direct compatibility with electronics [7][8][9][10]. Several electrooptical modulators have been demonstrated on a Si platform using resonant structures such as Mach-Zehnder interferometers [9,10], waveguide-ring-resonator geometries [7], and a hybrid Si-plasmonic platform [11,12] based on the application of an electric field via electrical interconnections, thus limiting the maximum modulation speed to a few tens of gigahertz.…”
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