Progress in Brain‐Compatible Interfaces with Soft Nanomaterials

Jeong, Yong‐Cheol; Lee, Han Eol; Shin, Anna; Kim, Dae‐Gun; Lee, Keon Jae; Kim, Daesoo

doi:10.1002/adma.201907522

Cited by 31 publications

(21 citation statements)

References 139 publications

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“…Material issues with thin‐film μLED are related to the epitaxial wafer, target substrate, electrode, transfer, and packaging. [ 3,5–19 ] Glass is currently one of the most widely used display substrates for TVs, smart phones, and tablet PCs. [ 20–23 ] Electrode materials for thin‐film μLEDs on a glass substrate need to be carefully optimized to improve RC delay, power efficiency, stability, and production cost.…”

Section: Figurementioning

confidence: 99%

A Flash‐Induced Robust Cu Electrode on Glass Substrates and Its Application for Thin‐Film μLEDs

et al. 2021

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displays based on individual chip transfer have already been demonstrated in a 150 inch commercial TV on the Consumer Electronics Show (CES) 2020. However, due to the time-consuming and expensive process of multimillion individual chip transfer for UHD TV, chip-based μLED has limitation in the mass production of low-cost μLED displays. In contrast, thinfilm μLED based on mass transfer of more than 10 000 LED chips in one time has great potential to reduce the product price of μLED panels. [1-4] Although many innovative studies of thin-film μLED technologies have been performed, little effort has been devoted to the fundamental materials in μLED devices and their effect on performance, reliability, and adhesion control. Material issues with thin-film μLED are related to the epitaxial wafer, target substrate, electrode, transfer, and packaging. [3,5-19] Glass is currently one of the most widely used display substrates for TVs, smart phones, and tablet PCs. [20-23] Electrode materials for thin-film μLEDs on a glass substrate need to be carefully optimized to improve RC delay, power efficiency, stability, and production cost. Cu is an attractive material for thin-film μLED electrodes due to its remarkable conductivity (5.98 × 10 5 S cm-1), [24] high robustness, [25,26] and cheap price (≈6500 times cheaper than Au), [27] A robust Cu conductor on a glass substrate for thin-film μLEDs using the flash-induced chemical/physical interlocking between Cu and glass is reported. During millisecond light irradiation, CuO nanoparticles (NPs) on the display substrate are transformed into a conductive Cu film by reduction and sintering. At the same time, intensive heating at the boundary of CuO NPs and glass chemically induces the formation of an ultrathin Cu 2 O interlayer within the Cu/glass interface for strong adhesion. Cu nanointerlocking occurs by transient glass softening and interface fluctuation to increase the contact area. Owing to these flash-induced interfacial interactions, the flash-activated Cu electrode exhibits an adhesion energy of 10 J m −2 , which is five times higher than that of vacuum-deposited Cu. An AlGaInP thin-film vertical μLED (VLED) forms an electrical interconnection with the flash-induced Cu electrode via an ACF bonding process, resulting in a high optical power density of 41 mW mm −2. The Cu conductor enables reliable VLED operation regardless of harsh thermal stress and moisture infiltration under a high-temperature storage test, temperature humidity test, and thermal shock test. 50 × 50 VLED arrays transferred onto the flash-induced robust Cu electrode show high illumination yield and uniform distribution of forward voltage, peak wavelength, and device temperature.

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Section: Figurementioning

confidence: 99%

A Flash‐Induced Robust Cu Electrode on Glass Substrates and Its Application for Thin‐Film μLEDs

et al. 2021

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“…Nanotechnology has facilitated the application of neuroimaging by developing brain-compatible neural devices. A novel device fabricated from soft nanomaterials is capable of accurately measuring cortical activity and obtaining in-depth information from target brain regions [ 73 ]. These soft nanomaterials are suitable for the invasive iEEG neuroimaging method to detect neurological disorders.…”

Section: Reviewmentioning

confidence: 99%

Intracranial recording in patients with aphasia using nanomaterial-based flexible electronics: promises and challenges

Wang

Siok

2021

Beilstein J. Nanotechnol.

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In recent years, researchers have studied how nanotechnology could enhance neuroimaging techniques. The application of nanomaterial-based flexible electronics has the potential to advance conventional intracranial electroencephalography (iEEG) by utilising brain-compatible soft nanomaterials. The resultant technique has significantly high spatial and temporal resolution, both of which enhance the localisation of brain functions and the mapping of dynamic language processing. This review presents findings on aphasia, an impairment in language and communication, and discusses how different brain imaging techniques, including positron emission tomography, magnetic resonance imaging, and iEEG, have advanced our understanding of the neural networks underlying language and reading processing. We then outline the strengths and weaknesses of iEEG in studying human cognition and the development of intracranial recordings that use brain-compatible flexible electrodes. We close by discussing the potential advantages and challenges of future investigations adopting nanomaterial-based flexible electronics for intracranial recording in patients with aphasia.

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“…With the advent of the internet of things (IoT) era, portable electronic devices have been spotlighted for their various applications spanning from personal health monitoring to hyperconnected social interactions. [1][2][3][4][5][6][7][8][9][10] The supply of electrical power is considered a key technology for the continuous operation GFRHybrimer film (370 × 470 mm 2 ) was enabled by microdome molding and nanopore formation on the film surface during the synthesizing process. The overall surface area of the SGH film increased up to 210% due to its hierarchical surface nano/micro structure.…”

Section: Introductionmentioning

confidence: 99%

Hierarchically Surface‐Textured Ultrastable Hybrid Film for Large‐Scale Triboelectric Nanogenerators

Lee

Wang

et al. 2020

Adv Funct Materials

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The supply of electrical power is indispensable in the internet of things (IoT) area. Triboelectric nanogenerators (TENGs) has been largely used as a power supply due to simple device structure and various possibilities of material selection. Although various surface modifications of TENG are utilized for improving the output performance of TENG, these methods have significant drawbacks of high-cost fabrication process, limited device size, and wearing out. Here, a mechanically robust TENG using a newly developed surface-textured glass fabric reinforced siloxane hybrid film (SGH film) is presented. The large-scale SGH film is cost-effectively fabricated via a simple roll-to-plate and UV curing process. The film is repeatedly duplicated over 100 times using one pre-treated substrate mold. SGH film exhibits superior thermal and mechanical stability, compared to other polymer films. Finally, surface textured TENG (THTENG) is achieved using extremely stable SGH film, resulting in enhanced output power compared to flat TENG and high durability during the 100 000 cycles of TENG operation.

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Progress in Brain‐Compatible Interfaces with Soft Nanomaterials

Cited by 31 publications

References 139 publications

A Flash‐Induced Robust Cu Electrode on Glass Substrates and Its Application for Thin‐Film μLEDs

A Flash‐Induced Robust Cu Electrode on Glass Substrates and Its Application for Thin‐Film μLEDs

Intracranial recording in patients with aphasia using nanomaterial-based flexible electronics: promises and challenges

Hierarchically Surface‐Textured Ultrastable Hybrid Film for Large‐Scale Triboelectric Nanogenerators

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