Progress and comparison in nondestructive detection, imaging and recognition technology for defects of wafers, chips and solder joints

Fang, Tianyu; An, Junshu; Chen, Qi; He, Yunze; Wang, Hongjin; Zhang, Xiaogang

doi:10.1080/10589759.2023.2274007

Nondestructive Testing and Evaluation

2023

DOI: 10.1080/10589759.2023.2274007

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Progress and comparison in nondestructive detection, imaging and recognition technology for defects of wafers, chips and solder joints

Tianyu Fang,

Junshu An,

Qi Chen

et al.

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2024

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Cited by 5 publications

References 117 publications

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Advancing surface mount technology quality: a computer-assisted approach for enhanced X-ray inspection of solder joints

Terra,

Santiago,

Vieira

et al. 2024

Int J Adv Manuf Technol

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The electronics industry is one of the fastest evolution, innovative, and competitive industries. Quality standards have been improved to meet the high demands of modern products, and new technologies have been applied for defect detection to meet customers' requirements. The importance of image processing tools becomes inevitable. This work deals with images obtained through X-ray for inspection in PCBA to identify non-conformities and provides assertive interpretation in less time. Software associated with the database of images collected from the product will be applied, and the criteria from IPC standards will be used to verify compliance.

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Advancing surface mount technology quality: a computer-assisted approach for enhanced X-ray inspection of solder joints

Terra,

Santiago,

Vieira

et al. 2024

Int J Adv Manuf Technol

View full text Add to dashboard Cite

show abstract

VMMAO-YOLO: an ultra-lightweight and scale-aware detector for real-time defect detection of avionics thermistor wire solder joints

Yang,

Liu,

et al. 2024

Front. Mech. Eng.

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Effect of solder void on mechanical and thermal properties of flip-chip light-emitting diode: Statistical analysis based on finite element modeling

Jo,

Sim,

Park

et al. 2024

Heliyon

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Progress and comparison in nondestructive detection, imaging and recognition technology for defects of wafers, chips and solder joints

Cited by 5 publications

References 117 publications

Advancing surface mount technology quality: a computer-assisted approach for enhanced X-ray inspection of solder joints

Advancing surface mount technology quality: a computer-assisted approach for enhanced X-ray inspection of solder joints

VMMAO-YOLO: an ultra-lightweight and scale-aware detector for real-time defect detection of avionics thermistor wire solder joints

Effect of solder void on mechanical and thermal properties of flip-chip light-emitting diode: Statistical analysis based on finite element modeling

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