Prognostication of accrued damage in board assemblies under thermal and mechanical stresses

Lall, Pradeep; Lowe, Ryan; Goebel, Kai

doi:10.1109/ectc.2012.6249031

Cited by 11 publications

(4 citation statements)

References 46 publications

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“…The experimental values of normalized IMC thickness (Y n ) have been plotted with respect to number of cycles (N) to compute the coefficient and exponent for Equation (13). The intercept (lnk 0 ) and slope (b 0 ) of Equation (13) have been plotted with respect to mean temperature to calculate the Activation energy of IMC growth for coefficient (E A ) and Activation energy of IMC growth for exponent (E B ) respectively.…”

Section: Damage Mapping Relationships For Imc Growthmentioning

confidence: 99%

“…The test data has been used to derive the parameters for normalized IMC growth of Equation (13). Micrographs of IMC thickness are shown in Figure 19 for CABGA 144, in Figure 20 for PBGA 256, and in Figure 21 for PBGA 676.…”

Section: Inter-metallic Thickness Growth Damage Proxymentioning

confidence: 99%

“…For prognostication of prior accrued damage using IMC growth as a damage proxy, Equation (22)which is obtained after simplifying Equation (13) has been used. Figure 31 and Table 24 show the prognosticated values of prior accrued damage using IMC growth rate as a damage indicator for the CABGA144 test assemblies exposed to thermal cycle of +50°C to +150°C.…”

Section: B Imc Thickness As Damage Proxymentioning

confidence: 99%

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Prognostication of the effect of mean temperature of thermal cycle on SAC305 leadfree reliability using damage pre-cursors

Lall

Mirza

2014

2014 International Conference on Prognostics and Health Management

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Electronics in automotive underhood applications may be subjected to temperatures in the neighborhood of 150°C to 175°C. Several electronic functions such as lane departure warning systems, collision avoidance systems are critical to vehicle operation. Prior studies have shown that low silver leadfree SnAgCu alloys exhibit pronounced deterioration in mechanical properties even after short exposure to high temperatures. Current life prediction models for second level interconnects do not provide a method for quick-turn assessment of the effect of mean temperature on cyclic life. In this paper, a method has been developed for assessment of the effect of mean cyclic temperature on the thermal fatigue reliability based on physics based leading damage indicators including phase-growth rate and the intermetallic thickness. Since the quantification of the thermal profile in the field applications may be often very difficult, the proposed method does not require the acquisition of the thermal profile history. Three environments of -50°C to +50°C, 0°C to 100°C, 50°C to 150°C with identical thermal excursion and different mean temperatures have been studied. Test assemblies with three different packages including CABGA 144, PBGA 324, and PBGA 676 have been used for the study. Damage-proxy based damage-equivalency relationships have been derived for the three thermal cycles. Weibull distributions have been developed for the three test assemblies to evaluate the effect of the mean cyclic temperature on the thermal fatigue life. Data indicates that the thermal fatigue lie drops with the increase in mean temperature of the thermal cycle even if the thermal excursion magnitude is kept constant. Damage equivalency model predictions of the effect of mean temperature of the thermal cycle have been validated versus weibull life distributions. The damage proxy based damage equivalency methodology shows good correlation with experimental data.

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Section: Damage Mapping Relationships For Imc Growthmentioning

confidence: 99%

Section: Inter-metallic Thickness Growth Damage Proxymentioning

confidence: 99%

Section: B Imc Thickness As Damage Proxymentioning

confidence: 99%

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Prognostication of the effect of mean temperature of thermal cycle on SAC305 leadfree reliability using damage pre-cursors

Lall

Mirza

2014

2014 International Conference on Prognostics and Health Management

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“…Previously a measurement technique known as resistance spectroscopy (RS) [1][2][3][4] has been demonstrated to effectively provide advanced warning of failure in electronics as they are subjected to a variety of harsh environments such as drop/shock [5], vibration [6], and simultaneous vibration and temperature [7]. The techniques ability to quantify damage prior to failure in a solder joint allows insight into the health of components attached to a circuit board to be monitored and mitigating action to be planned in the event of an impending failure.…”

Section: Introductionmentioning

confidence: 99%

Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability

Lall

Lowe

Goebel

2013

Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; M

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This paper compares three prognostic algorithms applied to the same data recorded during the failure of a solder joint in ball grid array component attached to a printed circuit board. The objective is to expand on the relative strengths and weaknesses of each proposed algorithm. Emphasis will be placed on highlighting differences in underlying assumptions required for each algorithm, details of remaining useful life calculations, and methods of uncertainty quantification. Metrics tailored specifically for Prognostic Health Monitoring (PHM) are presented to characterize the performance of predictions. The relative merits of PHM algorithms based on a Kalman filter, extended Kalman filter, and a particle filter all demonstrated on the same data set will be discussed. The paper concludes by discussing which algorithm performs best given the information available about the system being monitored.

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Approach for Reliability Evaluation of Cross-Linked Polyethylene Under Combined Thermal and Vibration Stresses

Liu

Zhang

Chen

et al. 2018

J. Shanghai Jiaotong Univ. (Sci.)

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Prognostication of accrued damage in board assemblies under thermal and mechanical stresses

Cited by 11 publications

References 46 publications

Prognostication of the effect of mean temperature of thermal cycle on SAC305 leadfree reliability using damage pre-cursors

Prognostication of the effect of mean temperature of thermal cycle on SAC305 leadfree reliability using damage pre-cursors

Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability

Approach for Reliability Evaluation of Cross-Linked Polyethylene Under Combined Thermal and Vibration Stresses

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