Processing of silicon by Nd:YAG lasers with harmonics generation

Panzner, Michael; Jörg, Kasper; Wust, Hendrik; Klotzbach, Udo; Beyer, Eckhard

doi:10.1117/12.470659

“…To fabricate a PS in silicon wafer three types of laser are used. 1) CO2 (ʎ=10.64µm) Laser [19], 2) Nd:YAG (ʎ=1.064µm) Laser [20], and 3) PFL (ʎ=1.064µm) [3,7]. The main demerit of CO2 laser wavelength is that it is not absorbed by the silicon wafer.…”

Section: Introductionmentioning

confidence: 99%

Design & Development of Laser Etched Porous-Silicon Capacitive Chip for Rapid Sensing of Pesticide Solvents

Gheewala

¹

,

Parmesh

²

,

Patel

³

et al. 2021

Preprint

0

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This work presents the development of porous silicon-based electrical sensor for the detection and quantification of organic solvents. The design of silicon chip is modeled as capacitive sensor. Different electrode configurations like coplanar top electrodes, top-bottom, coplanar bottom electrodes were analyzed in order to select optimum chip design for sensing application. The prototype chip was fabrication that used a mechanized pulse fiber laser etching process in order to develop a single-layer silicon structure with uniform porous structures. The fabricated chip was characterized using scanning electron microscopy and it shows an average pore diameter of 55.22 µm and pore depth of 98.9 µm. Organic solvents like ethanol, methanol, acetonitrile were tested and analyzed in order to investigate the performance of the proposed chip. Unlike porous silicon based optical sensors, the proposed sensor exhibited stable results up to 35 days at room temperature. The application of the proposed sensor chip is demonstrated for sensing and for the quantification of Atrazine chemical which is a pesticide solvent which is utilized in farming to control weeds. The sensitivity and the limit of detection was found to be 0.51 nF/ppm and 0.929 ppm respectively. The proposed capacitive-based porous silicon chip is suitable for time-effective and low-cost sensing and detection of organic solvents that are used in food industry.

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“…To fabricate a PS in silicon wafer three types of laser are used. 1) CO2 (ʎ=10.64µm) Laser [19], 2) Nd:YAG (ʎ=1.064µm) Laser [20], and 3) PFL (ʎ=1.064µm) [3,7]. The main demerit of CO2 laser wavelength is that it is not absorbed by the silicon wafer.…”

Section: Introductionmentioning

confidence: 99%

Design & Development of Laser Etched Porous-Silicon Capacitive Chip for Rapid Sensing of Pesticide Solvents

Gheewala

¹

,

Parmesh

²

,

Patel

³

et al. 2021

Silicon

0

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This work presents the development of porous silicon-based electrical sensor for the detection and quantification of organic solvents. The design of silicon chip is modeled as capacitive sensor. Different electrode configurations like coplanar top electrodes, top-bottom, coplanar bottom electrodes were analyzed in order to select optimum chip design for sensing application. The prototype chip was fabrication that used a mechanized pulse fiber laser etching process in order to develop a single-layer silicon structure with uniform porous structures. The fabricated chip was characterized using scanning electron microscopy and it shows an average pore diameter of 55.22 µm and pore depth of 98.9 µm. Organic solvents like ethanol, methanol, acetonitrile were tested and analyzed in order to investigate the performance of the proposed chip. Unlike porous silicon based optical sensors, the proposed sensor exhibited stable results up to 35 days at room temperature. The application of the proposed sensor chip is demonstrated for sensing and for the quantification of Atrazine chemical which is a pesticide solvent which is utilized in farming to control weeds. The sensitivity and the limit of detection was found to be 0.51 nF/ppm and 0.929 ppm respectively. The proposed capacitive-based porous silicon chip is suitable for time-effective and low-cost sensing and detection of organic solvents that are used in food industry.

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“…Most of the reported applications involve scribing of lines in silicon. There have been a few studies which have reported large area ablation of silicon [8][9][10] . However, this has not been explored largely for practical applications.…”

Section: Introductionmentioning

confidence: 99%

Femtosecond laser micromachining of crystalline silicon for ablation of deep macro-sized cavities for silicon-on-insulator applications

Bhaskar¹,

Philippe²,

Braud³

et al. 2019

Laser-Based Micro- And Nanoprocessing XIII

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We demonstrate the use of femtosecond laser micromachining for ablating macro-sized cavities in crystalline silicon. The method employed is laser milling in which the focused laser beam is raster scanned over the area to be removed. We report the achievement of very high volume ablation rates for the cavity of up to 8.48x10 6 µm 3 s -1 . To achieve such high rates, we make use of a high average power fiber laser source of 1030 nm wavelength and variable per pulse energy of up to 100 µJ. By carefully controlling the process variables such as pulse energy, repetition rate and scanner speed, the tradeoffs between micromachining quality and ablation rate are quantified. The developed process is applied on Siliconon-Insulator (SOI) wafers for improving performance of RF devices. By making use of laser removal and an additional step of selective silicon etch using XeF2, handler silicon is removed completely under RF circuits such as SP9T switch. The local removal of silicon under such circuits completely eliminates the losses and non-linearities caused by the coupling of RF signals to the semi-conducting substrate. Small-signal and large-signal RF measurements are performed before and after substrate removal to quantify the performance gain. The obtained performance after substrate removal is better than specialized RF-SOI substrates such as trap-rich SOI. This is of practical significance for next generation wireless technologies like 5G which operate at higher frequencies with stringent specifications. The proposed method is also potentially useful for fabricating membrane based devices in SOI technology such as pressure sensors.

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Processing of silicon by Nd:YAG lasers with harmonics generation

Cited by 15 publications

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Design & Development of Laser Etched Porous-Silicon Capacitive Chip for Rapid Sensing of Pesticide Solvents

Design & Development of Laser Etched Porous-Silicon Capacitive Chip for Rapid Sensing of Pesticide Solvents

Design & Development of Laser Etched Porous-Silicon Capacitive Chip for Rapid Sensing of Pesticide Solvents

Femtosecond laser micromachining of crystalline silicon for ablation of deep macro-sized cavities for silicon-on-insulator applications

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Processing of silicon by Nd:YAG lasers with harmonics generation

Cited by 15 publications

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Design &amp; Development of Laser Etched Porous-Silicon Capacitive Chip for Rapid Sensing of Pesticide Solvents

Design &amp; Development of Laser Etched Porous-Silicon Capacitive Chip for Rapid Sensing of Pesticide Solvents

Design & Development of Laser Etched Porous-Silicon Capacitive Chip for Rapid Sensing of Pesticide Solvents

Femtosecond laser micromachining of crystalline silicon for ablation of deep macro-sized cavities for silicon-on-insulator applications

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Design & Development of Laser Etched Porous-Silicon Capacitive Chip for Rapid Sensing of Pesticide Solvents

Design & Development of Laser Etched Porous-Silicon Capacitive Chip for Rapid Sensing of Pesticide Solvents