2013
DOI: 10.1016/j.mee.2012.02.019
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Processing of photonic crystals in InP membranes by focused ion beam milling and plasma etching

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Cited by 10 publications
(8 citation statements)
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“…When fabricating a system that incorporates both of these, care must be taken to protect areas from being undercut when not intended. Changing geometry or depositing protective dielectrics are common techniques used to realize this; [121] however, one can use the material alloying to obtain different absorber layer compositions which have a higher etch selectivity to the sacrificial etchant. This is often not 100% selective so some parasitic damage is to be expected [26].…”
Section: Discussionmentioning
confidence: 99%
“…When fabricating a system that incorporates both of these, care must be taken to protect areas from being undercut when not intended. Changing geometry or depositing protective dielectrics are common techniques used to realize this; [121] however, one can use the material alloying to obtain different absorber layer compositions which have a higher etch selectivity to the sacrificial etchant. This is often not 100% selective so some parasitic damage is to be expected [26].…”
Section: Discussionmentioning
confidence: 99%
“…Focused Ion Beam is a microscopy technique which can both image and structure surface of the materials -see figure 1, with the smallest spot size of 2.5 nm it is possible to manufacture very complex nanostructures in almost any inorganic conductive and unconductive materials [7][8][9][10][11][12] To improve the quality of surface imaging and the crystal patterning, the samples were covered with a 10 -20 nm layer of chromium which was removed afterwards. To figure out all the parameters of the FIB procedure, we had to conduct a series of quality and time optimization experiments.…”
Section: Focused Ion Beam Samples Productionmentioning
confidence: 99%
“…The technique is perfectly adequate as a fastprototyping method with a very direct path from computer simulations of the photonic pattern to first working prototypes. Because of those benefits FIB technique has been used for prototyping of both electrical and optical based nanostructure devices [7][8][9][10]. The FIB machine is a device similar to a SEM (scanning electron microscope), but it uses ions (mainly gallium) instead of electrons.…”
Section: Introductionmentioning
confidence: 99%
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“…FIB processing is an ideal tool regarding rapid testing and prototyping with high resolution. However, the low milling rates and charging effects of dielectric oxides may have some disadvantages for certain applications and a process combining hardmask structurering with dry etching [10] respectively introducing fs laser pulse processing is currently developed by us to optimize device quality and process time. …”
Section: Technological Device Fabricationmentioning
confidence: 99%